위치 추적 및 무선 통신 기술 분야 세계적 선도기업인 유블럭스(u-blox, 한국지사장 손광수)가 인포테인먼트와 내비게이션, 그리고 첨단OEM 텔레매틱스 등 차량용 애플리케이션을 지원하는 차량용 모듈을 출시했다.
Supports dual band Wi-Fi 6E and Bluetooth LE simultaneously
u-blox (September 2019), a global leader in positioning and wireless communication technologies, has launched an automotive module that supports vehicle applications such as infotainment, navigation, and advanced OEM telematics.
u-blox announced the launch of the JODY-W6, a module that supports dual-band Wi-Fi 6E with simultaneous support for Bluetooth 5.3 including LE Audio in a compact size of 13.8 x 19.8 x 2.5mm.
The new module is targeted at automotive applications including infotainment and navigation, as well as advanced OEM telematics.
According to the wireless connectivity market report by TSR (Techno Systems Research CO.LTD.), Wi-Fi 6 and 6E technologies are showing rapid growth in the automotive sector. Wi-Fi 6 focuses on efficiency, reducing data congestion, increasing network capacity, and reducing overall power consumption.
Wi-Fi 6E, on the other hand, focuses on spectrum to accommodate more concurrent users, reduce frequency congestion, and enhance security.
The u-blox JODY-W6 supports dual-mode Bluetooth with LE Audio along with Wi-Fi 6E. JODY-W6 is certified worldwide and can operate in temperatures ranging from -40°C to +105°C.
This module can utilize two or three antennas and can integrate LTE filters if required. EVK and M.2 cards for the JODY-W6 series are also scheduled to be released and are compatible with previous JODY module series for easy expansion.
“JODY-W6 provides a smart and reliable solution for devices that require overcoming congestion and scalability in a compact form factor that is highly adaptable,” said Sebastian Schreiber, Senior Product Manager Short Range at u-blox. “The module is ideally suited for use cases such as Apple CarPlay® and Android Auto™, personalized entertainment, data offloading, and smart/roof integrated antennas.”
The u-blox JODY-W6 features the AW693 embedded chipset from NXP Semiconductors.
“The AW693 System-on-Chip (SoC) embedded in our automotive JODY-W6 System-on-Module (SoM) opens up new business opportunities and broad automotive applications by leveraging the latest concurrent dual-band Wi-Fi 6E and Bluetooth LE audio technologies,” said Larry Olivas, vice president and general manager, wireless connectivity solutions at NXP Semiconductors. “The AW693 chipset includes a variety of advanced features such as MU-MIMO, OFDMA, and TWT (target wake time), and u-blox’s JODY-W6 module featuring this chip will be able to demonstrate the synergy effects of the partnership between the two companies,” he said.
The JODY-W6 module is currently sampling and is scheduled to enter mass production in Q1 2025.