Thermal ALD is a fast-growing technology in the latest node processes, and as logic nodes shrink, semiconductor manufacturers are rushing to secure the latest equipment needed for advanced processes. ACM Research has shown off its technological prowess by shipping advanced process equipment.

ACM Research (ACMR), a specialist in wafer processing solutions, today introduced a new Ultra Fn A furnace tool developed on the company’s 300mm Ultra Fn furnace dry processing platform.

The Ultra Fn A furnace equipment has been specifically designed to add thermal ALD capabilities, further expanding the range of supported ACM Research furnace equipment. The furnace equipment has already been delivered to a top foundry manufacturer in China, and the qualification process is expected to be completed in 2023.

ACM's new thermal ALD tool can deposit both silicon nitride (SiN) and silicon carbon nitride (SiCN) films, and its initial applications include manufacturing sidewall spacer layers in 28nm logic manufacturing processes. This process requires very low etch rates and excellent step coverage (the deposition thickness divided by the lateral deposition thickness), and the ACM emphasized that this equipment has improved uniformity compared to other implementation methods in simulations.

ACM's Ultra Fn A equipment is designed based on ACM's Ultra Fn furnace platform, providing a platform to support LPCVD dry process, oxidation, vacuum annealing for alloying, high temperature and other furnace common processes.

Additionally, this equipment was designed from the beginning to accommodate batch ALD processes that pursue best-in-class throughput. The equipment can be customized with minimal component and layout changes, enabling manufacturers to accelerate the development of new types of ALD processes.

Finally, ACM supports fast and stable process control through innovative design capabilities that combine proven SW technology, hardware with improved reproducibility and durability, and its own process control IP.

“As logic nodes continue to shrink, semiconductor manufacturers are looking for partners who can meet their equipment requirements for advanced processes like ALD,” said David Wang, ACM CEO and president. “ALD is one of the fastest-growing technologies in advanced node manufacturing and is a key new capability in ACM’s furnace portfolio.”

He also said, “With its deep expertise and innovation capabilities across the entire semiconductor manufacturing process, ACM was able to rapidly develop ALD capabilities – both wet and dry – to meet the needs of emerging markets.” He added, “The new ALD tool is built on ACM’s expanded furnace platform that includes atmospheric, low-pressure and vacuum capabilities.”