전체기사1,432건
[Serial Project] Physical AI: Redefining the Future of Industry ③, "Physical AI Sensors: A Key to Physical AI Competitiveness"
While conventional AI has focused on reasoning and generation within digital data, Physical AI directly acts and responds in the real world through se..
2025.11.11 by 명세환 기자
Siemens and NEC Join Forces to Innovate Manufacturing Robotics and Automation
Siemens has entered into a technology partnership with NEC and is moving forward with joint development of solutions in the field of robot 3D simulati..
2025.11.10 by 명세환 기자
Iocrops Opens the Future of Agricultural Automation with Physical AI Harvesting Robots… Wins Presidential Award at Startup Contest
Domestic AgTech company AIOCROP won a triple crown, including the Presidential Award, at the '2025 Agricultural and Food Start-up Contest' with its ph..
2025.11.10 by 명세환 기자
KETI and HL Mando Launch Collaboration to Expand the Robotics Industry Ecosystem
Korea Electronics Technology Institute (KETI) and HL Mando signed a memorandum of understanding on the 7th at 'Robot Plus Test Field' located in Seoch..
2025.11.07 by 명세환 기자
Vicor Fully Launches Strategy to Stabilize Supply Chains in AI, Automotive, and Industrial Markets
Vicor is strengthening its intellectual property (IP) business based on high-density power systems technology and taking full steps to stabilize suppl..
2025.11.07 by 배종인 기자
Mobilint Wins CES Innovation Award for Second Consecutive Year with AI Box 'MLX-A1'
AI semiconductor specialist Mobilint (CEO Shin Dong-ju) has won the Innovation Award in the Artificial Intelligence category at CES 2026, the world's ..
2025.11.07 by 명세환 기자
DeepX Wins Two CES 2026 Innovation Awards, Sixfab's ALPON X5 Wins Top Prize
Global AI semiconductor company DeepX (CEO Kim Nok-won) achieved a two-award sweep at CES 2026, the world's largest technology exhibition, earning rec..
2025.11.07 by 명세환 기자
.jpg)
ST Innovates Industrial Automation, Security, and Retail with 5MP Image Sensors
Global semiconductor company STMicroelectronics (ST) announced a new family of 5MP CMOS image sensors for industrial automation, security, and smart r..
2025.11.06 by 명세환 기자
Creaform Accelerates Targeting of Reverse Engineering Market with 'HandySCAN 3D|PRO Series'
Creaform has added the 'HandySCAN 3D PRO Series' to its flagship 3D scanner lineup. This new product is an all-in-one solution that integrates a high-..
2025.11.06 by 명세환 기자