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ST Launches GaN Power IC 'MasterGaN6'... Targeting Chargers, Lighting, and Solar Power
ST Microelectronics has launched the MasterGaN6, a second-generation MasterGaN half-bridge power IC. The product is characterized by integrating a GaN..
2026.03.18 by 배종인 기자
TI and Nvidia Unveil 800VDC Power Architecture… AI Data Center Power Transition Begins in Earnest
Texas Instruments (TI) has unveiled a next-generation 800VDC power architecture for AI data centers in collaboration with Nvidia. This architecture is..
2026.03.18 by 명세환 기자
Schneider Electric Unveils AI Data Center Infrastructure Vision at GTC 2026
Schneider Electric revealed its roadmap for building large-scale AI data center infrastructure alongside NVIDIA at GTC 2026. The presentation focused ..
2026.03.18 by 배종인 기자
Water electrolysis efficiency is increased by iron substitution
The Korea Institute of Materials Science (KIMS) has moved a step closer to realizing the hydrogen economy by developing a high-performance alkaline wa..
2026.03.17 by 배종인 기자
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NVIDIA Implements Real-Time Physical AI in Industrial Sites with 'IGX Thor'
NVIDIA officially launched 'IGX Thor,' a next-generation physical AI platform for industrial environments, at 'GTC 2026.' IGX Thor is designed to anal..
2026.03.17 by 배종인 기자
SK Hynix Showcases AI Memory Technology at NVIDIA GTC 2026
SK Hynix will participate in 'NVIDIA GTC 2026' held in San Jose, California from the 16th to the 19th, showcasing core technologies for AI infrastruct..
2026.03.17 by 배종인 기자
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L&F Unveils LFP Cathode Material Strategy at InterBattery 2026… Accelerating Establishment of Non-China Supply Chain
L&F unveiled next-generation cathode material technology and LFP (lithium iron phosphate) cathode material mass production plans at the domestic batte..
2026.03.16 by 배종인 기자
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NVIDIA Defines AI as a "Five-Layer Cake" and Releases a Blueprint for Next-Generation AI Infrastructure Transformation
Nvidia has defined AI as core infrastructure comprising a "5-tier cake" structure composed of energy, chips, infrastructure, models, and applications...
2026.03.11 by 배종인 기자
MPS, “‘MPM3695 Family’ Meets High-Current, Low-Voltage Power Supply Design Demands”
MPS Technical Support Director Jung Tae-hoon discusses integrated power modules for high-current power design, a new approach to flexible output volta..
2026.03.11 by 편집부