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ST Adds Sigfox Package to STM32 for Long-Range/Low-Power Wireless Network Connectivity
STMicroelectronics (ST) has added a Sigfox package to the STM32 software ecosystem. This package enables simplified development and enhances flexibili..
2018.02.28 by 김지혜 기자
Intel Launches FPGAs with 58G PAM4 Technology
Intel has launched the Intel Stratix 10 TX FPGA, the industry's only Field Programmable Gate Array (FPGA) equipped with 58G PAM4 transceiver technolog..
2018.02.28 by 김지혜 기자
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Lattice Launches Low-Power FPGA Lattice Radiant
Lattice announced the launch of Lattice Radiant software for low-power FPGA. Lattice Radiant software supports the iCE40 UltraPlus FPGA and expands th..
2018.02.27 by 김학준 기자
Schneider Electric Resolves Production Efficiency Issues with Asset Performance Management
Schneider Electric Software Korea, a company specializing in process optimization and automation, is expanding its AMP (Asset Performance Management) ..
2018.02.27 by 명세환 기자
u-blox Announces F9 Industrial and Automotive AP Positioning Solution
u-blox has announced the u-blox F9 technology platform, which provides high-precision positioning solutions for industrial and automotive mass-product..
2018.02.27 by 김학준 기자
Smack, remote power inspection 'KEPCO business contract'
Smack announced that it has won a bid for "PLC modem supply for the construction of remote meter reading infrastructure (AMI: Advanced Metering Infras..
2018.02.27 by 김학준 기자
ON Semiconductor Announces Multi-Sensor Shield to Support Application Development
ON Semiconductor has also announced a software upgrade for its multisensor shield and IoT Development Kit (IDK) that help customers efficiently develo..
2018.02.27 by 김학준 기자
SKT Wins "Enterprise Mobile Service Innovation Award," the Telecom Industry's Oscar
SK Telecom announced that its 'LiveCare' service won the 'Enterprise Mobile Service Innovation Award' at the MWC 2018 GSMA Global Mobile Awards. This ..
2018.02.27 by 김학준 기자
TI Launches Ultra-Small 36V 1A DC/DC Step-Down Power Module
TI announced the launch of two new 4V–36V power module products that measure only 3.0mm x 3.8mm and require just two external components. The 0.5A LM..
2018.02.27 by 김지혜 기자