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ST Equips Motion Sensing in Trackerphone That Protects Family Safety
STMicroelectronics (hereinafter ST) announced that its motion sensing and data processing chips have been adopted in the Snowfox Trackerphone, a devic..
2017.04.03 by 김지혜 기자
TI, Breakthrough Solutions for Industrial Systems from High Voltage to Ultra-Low Power
TI recently showcased reference designs incorporating the latest analog and embedded processing technologies at APEC, the largest power electronics in..
2017.03.30 by 김자영 기자
ST Launches Ultra-compact DC Motor Driver for Portable IoT Devices
STMicroelectronics (hereinafter ST) has launched the STSPIN250, a single-chip 2.6A driver for brushed DC motors, expanding its portfolio of energy-eff..
2017.03.30 by 김지혜 기자
[Decisive IT Scene] This is the Galaxy S8, the One That Will Make Up for the Note 7's Failure
Samsung Electronics held 'Samsung Galaxy Unpacked 2017' at Lincoln Center in New York on the 29th local time, unveiling its strategic smartphones 'Gal..
2017.03.30 by 김지혜 기자
onsemi Introduces 100V Bridge Power Stage Module for DC-DC Converters
onsemi has launched the FDMF8811, a 100V bridge power stage module for half-bridge and full-bridge isolated DC-DC converters. The 25 A rated device mo..
2017.03.30 by 김자영 기자
ST Announces NFC Reader and Discovery Kit
STMicroelectronics has launched the ST25R3911B-DISCO Discovery kit, which integrates its NFC reader IC ST25R3911B with the ultra-low-power microcontro..
2017.03.29 by 김자영 기자
Lenovo Accelerates Push into Domestic Gaming Market with VR-Capable PC
Lenovo Korea announced the launch of the Y720 gaming notebook supporting virtual reality (VR) in the domestic market. Following the recent release of ..
2017.03.29 by 김자영 기자
USB Type-C, design is important for use regardless of cable
A new type of USB has emerged. As USB Type-C ports become more prevalent in tablets, notebooks, and smartphones, early adopters are experiencing issue..
2017.03.29 by 김지혜 기자
Infineon Launches 62mm IGBT Module Offering High Power Density
Infineon Technologies has launched a new 62mm IGBT module. The new power module, which uses a larger chip area and modified DCB substrate in the prove..
2017.03.28 by 김자영 기자