전체기사7,508건
“Finding On-Device AI Success Stories is the Key”
On-device AI-based products have recently been rapidly building up across various sectors. In this context, a venue was established for sharing insigh..
2024.10.21 by 권신혁 기자

“Future Mobility Hyper-Connectivity Is Essential, EMI/EMC Issues↑”
As various wireless and communication technologies are being integrated into vehicles, advancements in EMI/EMC technology that can ensure automotive r..
2024.10.21 by 권신혁 기자
Infineon's best-in-class fingerprint sensor helps personalize cars and make payments
Infineon Technologies (Korea CEO Lee Seung-soo) has launched the CYFP10020A00 and CYFP10020S00, best-in-class fingerprint sensor ICs for identificatio..
2024.10.21 by 배종인 기자
Microchip Receives Highest Level of Certification for Space Industry Components
Microchip Technology, a global leader in microcontrollers, mixed-signal, analog semiconductors and flash-IP solutions (Asia General Manager and Korea ..
2024.10.21 by 배종인 기자
[Contribution] Professor Kim Pil-su of Daerim University - “The Ministry of Environment’s smart control slow charger distribution must be expedited”
We heard from Professor Kim Pil-su of Daelim University College about the distribution of smart-controlled slow chargers to prevent electric vehicle f..
2024.10.21 by 명세환 기자
Infineon lowers SiC solution cost and improves vehicle performance
Infineon Technologies (Korea CEO Lee Seung-su) has launched a new HybridPACK™ Drive G2 Fusion power module for traction inverters in the e-mobility se..
2024.10.17 by 배종인 기자
Kobo, Innovative Advancement in Semiconductor Circuit Breaker Technology
Qorvo®, a global leader in wireless communications and power solutions, has achieved a breakthrough in semiconductor circuit breaker (SSCB) technology..
2024.10.15 by 배종인 기자
ST, Motor Drive Evaluation Board Saves 70% Board Space
STMicroelectronics, a global semiconductor company supporting diverse electronic applications and customers, has launched the three-phase driver PWD5T..
2024.10.15 by 배종인 기자
TI, 'Power Module' Magnetic Packaging Technology Doubles Power Density and Increases Efficiency by 2%
Texas Instruments (TI) has achieved double the power density while maintaining superior thermal performance with new power modules featuring MagPack™ ..
2024.10.15 by 배종인 기자

