‘하이브리드 본딩’ 키워드 기사 4 articles
Benjamin Hein, Merck Electronics CEO: "AI is a systems battle, moving beyond materials to integrated workflow"
Benjamin Hein, CEO of Merck Electronics, stated that in the AI era, semiconductor competitiveness depends on system-wide optimization rather than indi…
2026.10.22 by 배종인 기자
Applied Materials and Besi Expand AI Packaging Partnership
Applied Materials and Besi are expanding their strategic partnership to respond to growing demand for highly integrated semiconductor packaging driven…
2026.10.02 by 배종인 기자
Applied Materials Targets 'Memory Wall' in AI Era...Presents Solutions Across D-RAM, HBM, and Packaging
In the artificial intelligence (AI) era, semiconductor industry competition hinges on 'data movement' rather than 'computation'. As AI models grow lar…
2026.08.31 by 배종인 기자
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AI will spread to smartphones, robots, and wearables after 2028.
As the artificial intelligence (AI) era advances, structural changes in the global semiconductor industry are accelerating. High-value-added memory su…
2026.02.23 by 배종인 기자