DeepX Launches NPU-Based AI Acceleration Module for Raspberry Pi 5
Ultra-low-power AI semiconductor company DEEPX has launched the 'Sixfab AI HAT+', an AI acceleration module based on the DX-M1 NPU, globally in cooper…
2026.06.25 by 배종인 기자
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Syma AI Launches Physical AI Development Platform 'Palette Neat'
Sima AI launched 'Palette Neat', an agentic development platform specialized in physical AI application development, on June 17th. It constructs the e…
2026.06.17 by 명세환 기자
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DeepX Unveils DX-M1 with Local Partner at Japan's DX Week 2026
DeepX participated in DX Week 2026, held from April 8th to 10th at Tokyo Big Sight in Japan, and showcased its AI semiconductor 'DX-M1' alongside loca…
2026.04.13 by 배종인 기자
Congatec Expands Intel Core Ultra 3-Based Industrial COM… Enhances Response to Extreme Temperatures
Congatec has expanded its product lineup of industrial Computer-on-Module (COM) based on Intel Core Ultra Series 3 with an extended temperature range …
2026.04.08 by 명세환 기자
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Congatec Extends Performance of AMD Ryzen AI-Based COM Modules… Expanding Edge AI Design Flexibility
Congatec has enhanced the performance and scalability of the 'conga-TCRP1', a COM Express module based on AMD Ryzen AI Embedded P100 series. The modul…
2026.03.17 by 명세환 기자
congatec Expands its Intel Core Series 2-Based COM-HPC Modules
As real-time control and parallel data processing demands grow in industrial environments, the role of high-performance edge computing modules is expa…
2026.03.11 by 명세환 기자