SK Hynix Develops Next-Generation Mobile NAND Solution 'ZUFS 4.0'
As data movement and capacity increase in the AI era, memory performance is also becoming an important factor for realizing on-device AI. SK Hynix has…
2024.05.09 by 명세환 기자
K-Memory Light and Dark Crossroads, HBM Booms vs DRAM/NAND Demand Uncertain
As AI-based infrastructure begins to be constructed in earnest, demand for high-bandwidth memory has surged dramatically. In the B2B market, HBM deman…
2024.05.08 by 권신혁 기자
SK Hynix CEO Kwak No-jeong: “Next year’s production of HBM also sold out”
SK Hynix CEO Kwak Noh-jung stated in a press briefing, "From a production perspective, SK Hynix HBM is already sold out this year, and next year is al…
2024.05.02 by 배종인 기자
Adoption of High-Capacity Memory Driven by AI Infrastructure Rises, “Supply Tight in Second Half”
Companies are racing to launch services centered on generative AI, and competition to build AI server infrastructure is intensifying. Proactive invest…
2024.04.30 by 권신혁 기자
SK Hynix decides on new DRAM production base for M15X in Cheongju
SK Hynix has decided to proactively respond to the surging demand for AI semiconductors by expanding production capacity for next-generation DRAM, inc…
2024.04.25 by 배종인 기자
SK Hynix Hits Big with HBM… 1Q Operating Profit 2.886 Trillion Won, Up 784% YoY
As generative AI services have become visible, demand for HBM destined for AI servers has surged sharply, with SK Hynix reaching record-high stock pri…
2024.04.25 by 권신혁 기자
Panesia, CXL Interoperability Verification Demonstration...Spurring Domestic Fabless Overseas Strategy
Global big tech companies are intensifying their competition to develop ultra-large-scale AI. As these massive AI models evolve into larger and more c…
2024.04.23 by 권신혁 기자
China's semiconductor boom continues... Self-sufficiency lies in 'money flow'
When authenticity is in doubt, one should look at where the money is being spent. This is a phrase commonly used in political circles, and among the i…
2024.04.22 by 권신혁 기자
SK Hynix, TSMC join hands...Strategic collaboration on HBM4 packaging
SK Hynix, which holds market leadership in HBM technology, is expected to move into mass production of customer products for next-generation HBM4 by l…
2024.04.19 by 권신혁 기자
SK Hynix Vice President Woojin Choi: “We will strengthen our advanced packaging technology leadership through limitless challenges”
SK Hynix's P&T (Packaging & Test) head Vice President Choi Woo-jin has dedicated himself to research and development in memory semiconductor packaging…
2024.04.12 by 권신혁 기자
SK Hynix Invests 5.2 Trillion Won in AI Advanced Packaging
SK Hynix has decided to construct an advanced packaging production facility for AI memory in West Lafayette, Indiana, USA, and to collaborate with loc…
2024.04.04 by 배종인 기자
Korean AI Rally Foreign Buyers, SK Hynix Market Cap Surpasses $100 Billion
As global manufacturing conditions show signs of recovery, a spring breeze is blowing through Korea's import-export sector and stock market as well.
2024.04.01 by 권신혁 기자
SK Hynix Saves 40 Billion Won in Purchase Costs by Recycling Neon
SK Hynix has successfully developed neon recycling technology, which is expected to reduce costs associated with neon procurement and greenhouse gas e…
2024.04.01 by 배종인 기자
SK Hynix Unveils New SSD Products for AI PCs at NVIDIA GTC
With the emergence of AI PCs, high-speed and high-bandwidth memory performance is becoming increasingly important. In response, SK Hynix, participatin…
2024.03.20 by 권신혁 기자
SK Hynix begins full-scale mass production of next-generation AI memory 'HBM3E'
SK Hynix demonstrated its position as a leading AI memory company with the fifth-generation HBM HBM3E DRAM.
2024.03.19 by 권신혁 기자