‘광 인터커넥트’ 키워드 기사 3 articles
EVG Supports Resolution of CPO Manufacturing Challenges for AI Data Centers
As the importance of CPO (Co-Packaged Optics), a high-bandwidth and low-power optical interconnect technology, grows with expanding AI data center dem…
2026.09.02 by 배종인 기자
SK Hynix Unveils Next-Generation AI Infrastructure Blueprint Based on Optical Interconnect
SK Hynix has disclosed its CPO (Co-Packaged Optics) roadmap, a core technology for next-generation AI infrastructure, to Nature Electronics. To addres…
2026.08.21 by 배종인 기자
.jpg)
ST Begins Full-Scale Mass Production of Silicon Photonics Targeting AI Data Centers
STMicroelectronics (ST) has commenced mass production of its industry-leading silicon photonics platform 'PIC100' in response to the proliferation of …
2026.03.25 by 배종인 기자