ACM Research to Supply Wafer Wet Etcher ‘Bevel Etch’
During IC manufacturing processes in 3D NAND, DRAM, and advanced logic nodes, wafer edge yield degradation is occurring due to wafer edge delamination…
2021.08.26 by 이수민 기자
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[China Briefing] Taiwan and the US Strengthen Their Semiconductor Honeymoon
e4ds News China Region ICT Brief - August 26, 2021 [China Briefing]: ◇Taiwan-U.S. strengthen industrial cooperation including semiconductor sector bas…
2021.08.26 by 이춘영 외신
[China Briefing] TSMC Commercializes 5th Generation CoWoS Packaging
e4ds News - China ICT Briefing - August 24, 2021 [China Briefing]: ◇TSMC Announces New CoWoS, Preparing for Next-Generation HBM3 Products ◇BOE Secures…
2021.08.24 by 이춘영 외신
[China Briefing] ST Malaysia Plant Closure: A Good Thing for Taiwan?
e4ds News China ICT Briefing - August 20, 2021 [China Briefing]: ◇ST to Close Malaysia Packaging Plant "Taiwanese Companies to Benefit" ◇Huawei Hubble…
2021.08.20 by 이춘영 외신
[China Briefing] Baidu Unveils Automotive Robot Concept Car
e4ds News China ICT Updates - August 19, 2021 [China Briefing]: ◇Baidu announces autonomous vehicle robot 'Apollo' concept ◇Apple delays mass producti…
2021.08.19 by 이춘영 외신
DB HiTek, Sailing Smoothly in First Half: "No Expansion Yet, Maximizing Available Capacity"
DB Hytech announced that it recorded its largest quarterly results in the second quarter of 2021 with sales of 274.7 billion won and operating profit …
2021.08.19 by 이수민 기자
STMicroelectronics Announces First Production of 200mm SiC Wafers, Procuring 40% of the Production In-House
STMicroelectronics has announced that it has produced prototype 200mm SiC bulk wafers with minimized crystal threading dislocations and reduced defect…
2021.08.10 by 이수민 기자
[China Briefing] TSMC Aheads Samsung, Launches 3nm in Second Half
e4ds News China-Taiwan-Hong Kong ICT News Roundup - August 9, 2021 [China Briefing]: ◇TSMC begins installing 3nm manufacturing equipment one year ahea…
2021.08.09 by 이춘영 외신
[China Briefing] Foxconn Launches Full-Scale Electric Vehicle Chip Business
e4ds News China ICT Briefing - August 6, 2021 [China Brief]: ◇Foxconn acquires wafer fab, targeting EV semiconductor market ◇SMIC announces better-tha…
2021.08.06 by 이춘영 외신
Black phosphorus, could it become the main material for angstrom semiconductors smaller than nanometers?
The IBS Multidimensional Carbon Materials Research Group has realized a conductive channel with a linewidth of 0.43nm using two-dimensional black phos…
2021.07.30 by 이수민 기자
[China Briefing] China to produce 14nm chips with its own technology by 2022?
e4ds News China ICT Briefing - July 29, 2021 [China Briefing]: ◇Huawei launches smartphone equipped with 14nm AP produced by SMIC ◇TSMC accelerates 2n…
2021.07.29 by 이춘영 외신
Intel CEO: "Number of nanometers is just a marketing slogan" as foundry business launches
Intel introduced naming conventions such as "Intel 7/4/3/20A" to enable customers to accurately understand nano-scale processes, acknowledging that na…
2021.07.27 by 이수민 기자
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[China Briefing] "The US-China Semiconductor Conflict Won't Benefit the US"
e4ds News China ICT Briefing - July 27, 2021 [China Briefing]: ◇China's semiconductor market and investment scale ranks first globally ◇China's displa…
2021.07.27 by 이춘영 외신
[China Briefing] FF Successfully Lists on NASDAQ Without Mass-Produced Vehicles
e4ds News China ICT Brief - July 22, 2021 [China Briefing]: ◇Faraday Future lists on Nasdaq despite lack of mass production vehicles, stock price surg…
2021.07.22 by 이수민 기자
Successful mass production of 12-inch wafer recycling facilities in China
China's first mass production facility for 12-inch wafer reclamation has begun operations, enabling the country to independently produce wafer remanuf…
2021.07.22 by 배종인 기자