Nepes aggressively targets AI semiconductors with 8-layer RDL interposer technology.
Netpass is aggressively targeting the inference artificial intelligence market, which has significant growth potential, with its new 8-layer RDL inter…
2024.06.05 by 배종인 기자
Nepes to commercialize AI semiconductor packaging technology
Netpass has completed the development of PoP technology, which is a foundational technology for 2.5D packaging, utilizing its proprietary redistributi…
2024.05.20 by 배종인 기자
Nepes receives large orders for PMIC for AI semiconductors… Investment of over KRW 60 billion
Netpass is receiving large volume orders for PMICs for artificial intelligence (AI) semiconductors and is making a full-scale push into investments ex…
2024.04.15 by 배종인 기자
Nepas, Semiconductor HBM Plating Solution Mass Production Begins in Full Scale
Netpass has been working on the localization of plating solution, a functional semiconductor material that has been entirely dependent on imports, thr…
2024.04.04 by 배종인 기자
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Nepes begins mass production of advanced PMIC packaging
Semiconductor backend processing company Nepes has recently begun receiving orders for power semiconductors for artificial intelligence (AI) chipsets …
2024.02.26 by 배종인 기자
Semiconductor Market Recovery Remains Question Mark This Year… Focus on AI Semiconductors
At the 2023 e4ds Semiconductor Packaging Day, there were forecasts suggesting that the semiconductor market this year may not recover easily.
2023.07.03 by 명세환 기자
Semiconductor Packaging Materials Market to be Worth $30 Billion by 2027
The global semiconductor packaging materials market is projected to grow at a compound annual growth rate of 2.7% and reach approximately $30 billion …
2023.05.24 by 배종인 기자
Neopass and Seoul Metropolitan Office of Education Join Hands to Revitalize Semiconductor Education
Neopass (Chairman Lee Byung-gu), an advanced semiconductor specialist company, has joined hands with the Seoul Metropolitan Office of Education (Super…
2023.04.25 by 배종인 기자
Nepes Secures High-Density, Ultra-Thin 3D Packaging Technology
Advanced semiconductor back-end foundry specialist Nepes (CEO Lee Byung-gu) has secured high-density ultra-thin film 3D packaging technology applicabl…
2023.04.12 by 배종인 기자
NEPES Showcases Next-Generation Packaging Technology at '2022 ECTC'
Nepes introduces next-generation package solutions at the Korean Society of Electronic Engineers and Technologists, establishing a foundation for new …
2022.05.31 by 배종인 기자