‘AI 패키징’ 키워드 기사 3 articles
Applied Materials and Besi Expand AI Packaging Partnership
Applied Materials and Besi are expanding their strategic partnership to respond to growing demand for highly integrated semiconductor packaging driven…
2026.10.02 by 배종인 기자
Lam Research Establishes Salzburg Panel Innovation Center… Aims to Transition to Mass Production of AI Packaging
Lam Research has established a Panel Innovation Center in Salzburg, Austria. The facility is an R&D center built on panel-level wet process technology…
2026.05.26 by 배종인 기자
Broadcom Joins Applied EPIC… Pursuing AI Packaging Collaboration
Applied Materials announced Broadcom as an EPIC platform partner and will collaborate on developing advanced packaging technologies for AI systems. Br…
2026.05.21 by 배종인 기자