TI Launches Audio ADC Capturing Voice from 10m Away
Smart home system developers require far-field voice capture performance to implement voice command functionality. However, until now, it has been cha…
2019.11.19 by 이수민 기자
The reality and breakthrough of the Korean semiconductor industry, the answer is the memory gap and next-generation semiconductor development
Korea maintains a strong position in the memory semiconductor market. However, the memory semiconductor market accounts for only 30.7% of the overall …
2019.11.18 by 이수민 기자
Global silicon wafer shipments decline for the fourth consecutive quarter
SEMI announced that global silicon wafer shipments have shown a declining trend for four consecutive quarters. In the third quarter of 2019, global si…
2019.11.14 by 이수민 기자
AI Implementation in Mid-Range Devices, Arm Announces 4 ML-Optimized IP Products
As market demand for AI increases, machine learning implementation is expanding not only in high-end devices but also in mid-range devices with limite…
2019.11.12 by 이수민 기자
Mouser Electronics supplies TI embedded processor 'Sitara AM574x'
Mouser Electronics announced that it supplies the Sitara AM574x processor from Texas Instruments (TI). The AM574x, which provides Arm Neon extension c…
2019.11.11 by 이수민 기자
ST Launches 'TCPP01-M12' USB-C Port Protection IC
STMicroelectronics has launched the TCPP01-M12 USB-C port protection IC. The TCPP01-M12 enables migration of small electronic devices from conventiona…
2019.11.11 by 이수민 기자
Amid the intensifying US-China hegemony competition, what are Korea's ICT breakthroughs? 2020 ICT Industry Outlook Conference held.
The Ministry of Science and ICT will hold the 2020 ICT Industry Outlook Conference at the Korea Chamber of Commerce and Industry in Jung-gu, Seoul ove…
2019.11.05 by 이수민 기자
Mouser Supplies Microchip Sub-1GHz RF Modules
Mouser Electronics supplies the SAM R30 Sub-1GHz module from Microchip Technology. The SAM R30 module is designed for use in unlicensed frequency band…
2019.11.05 by 이수민 기자
Microchip announces PSE chipset that requires no board redesign
Power over Ethernet (PoE) technology is being adopted to manage data and power through a single Ethernet cable. Now, pre-standard Power Devices (PD) m…
2019.10.28 by 이수민 기자
TI Introduces Two Robust Industrial Ethernet PHY Transceivers
Ethernet PHY products have been launched that can be applied across industrial, automotive, and general-purpose applications. Texas Instruments has re…
2019.10.25 by 이수민 기자
Microchip Launches Low-Power Radiation-Resistant FPGA for Space
Space applications are increasingly transmitting processed data rather than simple raw data. Additionally, to maximize the utilization of limited down…
2019.10.24 by 이수민 기자
u-blox unveils M9 platform providing meter-level location information
u-blox has unveiled the M9 global positioning tracking technology platform capable of providing meter-level positioning accuracy. The UBX-M9140 GNSS c…
2019.10.22 by 이수민 기자
SK Hynix Develops Third-Generation 10nm DDR4 DRAM, Produced Without EUV Process
SK Hynix announced the development of 16Gbit DDR4 DRAM using third-generation 10-nanometer-class (1z) advanced process technology. The third-generatio…
2019.10.22 by 이수민 기자
Nordic Launches 'nRF52833' SoC Supporting Multiprotocol
Nordic Semiconductor has announced the nRF52833 multiprotocol SoC, the fifth product in the nRF52 series. The nRF52833 supports Bluetooth LE, Thread, …
2019.10.22 by 이수민 기자
Byco launches a power solution every two years that promises 25% higher power density and 25% lower power loss.
As the amount of data requiring processing continues to grow, the power consumption associated with it is also increasing. This is why high-performanc…
2019.10.21 by 이수민 기자