"Now an essential element of home appliances" Variable speed drive must be implemented for efficient use of BLDC motors
Recently, with increasing requirements for energy efficiency, lifespan, noise reduction, and safety in motor applications, the use of BLDC motors has …
2019.10.21 by 이수민 기자
4 Types of 'Click Boards' Equipped with 'STSPIN' Motor Driver Launched
ST Microelectronics has collaborated with partner Mikroelektronika to develop four Click Board solutions. The four Click Boards enable the application…
2019.10.17 by 이수민 기자
Maxim Launches ASIL-D Compliant EV Battery Monitor IC 'MAX17853'
In automotive applications, redundant components are sometimes added to systems to comply with safety standards. Maxim Integrated has launched MAX1785…
2019.10.17 by 이수민 기자
Arm Unveils 'Arm Custom Instructions' to Add Custom Commands to Embedded CPUs
Arm has unveiled Custom Instructions, a new feature for embedded CPUs. Through Arm Custom Instructions, SoC designers can add desired instructions for…
2019.10.16 by 이수민 기자
KETI Successfully Develops SiC/GaN Drive Circuit for Power Semiconductors
KETI has developed high-performance driving technology for next-generation power semiconductor devices that enables miniaturization and high-efficienc…
2019.10.16 by 이수민 기자
ADI Launches Process Control AFE with Integrated 24-Bit ADC
Analog Devices has released the AD4110-1, a universal input AFE integrating a 24-bit ADC for industrial process control systems. The high-voltage inpu…
2019.10.15 by 이수민 기자
How Far Has AI Semiconductor Technology Come? [Electronic Warfare Keynote Issues]
The AI processor market is projected to reach $91.185 billion, or approximately 109.42 trillion won, by 2025. The 50th Korea Electronics Show 2019, he…
2019.10.14 by 이수민 기자
ST Launches 12-Channel LED Driver for Automotive Lighting
ST Microelectronics has launched the ALED1262ZT, a 12-channel LED driver for automotive rear combination lamps and interior lighting. The ALED1262ZT p…
2019.10.11 by 최인영 기자
ROHM Announces Automotive Comparator with High EMI Withstand
As electronization and high-density implementation advance in automotive systems, the noise environment is deteriorating. In response, Rohm announced …
2019.10.11 by 이수민 기자
Microchip Launches Bluetooth 5.0 Certified Dual-Mode IC and Module
Microchip Technology has launched the IS2083, a Bluetooth 5.0 certified dual-mode audio IC, and the BM83 module, which has received certification with…
2019.10.08 by 이수민 기자
The 50th Korea Electronics Show 2019, celebrating the 60th anniversary of the Korean electronics industry, opens.
The 50th Korea Electronics Show 2019, commemorating the 60th anniversary of South Korea's electronics industry, will be held from the 8th to the 11th …
2019.10.08 by 이수민 기자
eGaN FET for LiDAR - Maximizing Laser Driver Performance Part 2
LiDAR is a form of radar that generates electromagnetic waves in a broadband spectrum. Over the past several years, a specific type of LiDAR known as …
2019.10.07 by 최인영 기자
Samsung Electronics Creates 24GB HBM with 12-Layer 3D-TSV Technology
Samsung Electronics has developed 12-layer 3D through-silicon via (3D-TSV) technology. 12-layer 3D-TSV is a packaging technology that instead of conne…
2019.10.07 by 이수민 기자
Silicon Labs Supports Simplifying IoT Product Design with New Mesh Networking Module
Silicon Labs has launched new wireless Gecko modules to help IoT developers reduce product development costs and design complexity. The MGM210x and BG…
2019.10.04 by 이수민 기자
Microchip simplifies hardware-based IoT security with pre-provisioning solution
Hardware-based security is the only method that can protect secret keys from physical attacks and remote data extraction. However, setting up and prov…
2019.10.04 by 이수민 기자