Toshiba Unveils 2.5-inch NVMe SSD Targeting Data Centers
Toshiba has strengthened its data center NVMe SSD product lineup by adding a 2.5-inch form factor offering. The new PCIe Gen3x4 NVMe SSD uses a 2.5-in…
2019.03.16 by 이수민 기자
Infineon Launches XDPL8221 LED Driver for Smart and Connected Lighting
Infineon has launched the XDPL8221, part of its XDP LED driver series. The XDPL8221 combines a quasi-resonant PFC and quasi-resonant flyback controlle…
2019.03.15 by 이수민 기자
Infineon Launches iMOTION IMM100 Series… PCB Size Miniaturization and Simplified Development Work
Infineon Technologies is launching an intelligent IPM motor controller that fully integrates essential hardware and software for BLDC motor drives up …
2019.03.12 by 이수민 기자
ROHM Develops Miniature Contactless Current Sensor with '0' Power Loss Based on MI Elements
Recently, in data centers handling high power, servers, solar power generation systems and other applications, visualization of power and safety measu…
2019.03.11 by 이수민 기자
Samsung Electronics ships eMRAM based on 28nm FD-SOI process
Samsung Electronics has shipped eMRAM solution products based on 28nm FD-SOI process. The FD-SOI process is a process that can reduce leakage current …
2019.03.06 by 이수민 기자
Infineon Launches the TLE985x Series, a Family of Automotive Embedded Power Products Compliant with AEC Q-100 Standards
Infineon Technologies has launched the TLE985x series. The new embedded power IC product family provides highly integrated H-bridge driver motor contr…
2019.03.05 by 이수민 기자
Nordic Semiconductor Fully Supports Bluetooth 5.1, Improves Location Services with Direction Finding
Until now, Bluetooth location services have used signal strength to determine indoor positioning between devices and calculate distances. On January 2…
2019.03.04 by 이수민 기자
Microchip Launches USB 3.1 SmartHub IC for Automotive Infotainment with USB Type-C Support
As firmware updates and large-capacity media files become commonplace in automotive entertainment consoles, the need for faster data transmission spee…
2019.03.02 by 이수민 기자
Samsung Electronics begins mass production of 512GB eUFS 3.0, promising mobile devices faster than laptops.
Samsung Electronics has begun mass production of 512GB eUFS 3.0, the next-generation mobile memory, securing a leading position in the premium smartph…
2019.02.28 by 이수민 기자
ADI Launches 'SHARC Audio Module Platform' to Accelerate Audio DSP Project Development
Analog Devices has released the SHARC Audio Module, a hardware/software platform that facilitates efficient product prototyping, development, and manu…
2019.02.27 by 이수민 기자
ams Launches Infrared Illuminator Optimized for 3D Optical Sensing in Mobile Devices
ams has launched the MERANO-PD, an infrared laser illumination module that provides uniform lighting output for mobile 3D sensing applications such as…
2019.02.27 by 이수민 기자
Nordic Launches SoC with Bluetooth 5.1 Direction Finding Support
Nordic Semiconductor has launched the nRF52811 SoC, a connectivity solution that supports Bluetooth 5.1 direction finding capabilities and various gen…
2019.02.26 by 이수민 기자
[5G! MWC19] 'From Core to Edge' Intel Announces New Products and Partnerships to Drive 5G Revolution
Intel unveiled new products, partnerships, and customer use cases at MWC19. Intel announced its 10nm SoC Snow Ridge for base stations to enhance compu…
2019.02.26 by 이수민 기자
[5G! MWC19] Samsung Electronics Showcases 5G Commercial Technology, From Smartphones to Communications Equipment
Samsung Electronics will showcase an integrated 5G solution spanning from chipsets to smartphones and telecommunications equipment at MWC19, demonstra…
2019.02.25 by 이수민 기자
Cumulative sales of Embedded Security IC 'ST33' surpass 1 billion won... Growing need for data and system protection
ST Microelectronics' embedded security IC ST33 has surpassed cumulative sales of 1 billion units. Through the flexible architecture of the ST33 produc…
2019.02.24 by 이수민 기자