Infineon Launches Reverse-Conducting IGBT for IH Applications
Infineon Technologies has launched the IGBT Protected series of TRENCHSTOP technology for induction heating. The new product family integrates a dedic…
2019.01.29 by 이수민 기자
ST 'NFC IC and 8-bit MCU' Adopted in ROHM Automotive Wireless Charging Reference
ST Microelectronics' automotive NFC reader IC ST25R3914 and automotive 8-bit microcontroller STM8AF have been adopted in Rohm's Qi-compatible automoti…
2019.01.29 by 이수민 기자
Mouser Supplies TI TPSM846C24 High-Density Step-Up Power Modules
Mouser Electronics announced that it supplies Texas Instruments' power module TPSM846C24. The 35A module TPSM846C24 protects circuits from overcurrent…
2019.01.28 by 이수민 기자
EV Group Launches Next-Generation Fusion Wafer Bonding Equipment
EV Group, a supplier in the fields of MEMS, nanotechnology, wafer bonding for semiconductor manufacturing, and lithography equipment, has unveiled Bon…
2019.01.28 by 이수민 기자
2019 Semiconductor Market Kneels to Global Economic Downturn but Gains Momentum from IoT
Jim Peldhman, chairman of Semico Research Group, stated on the 23rd at Semicon Korea 2019 that while the 2019 semiconductor market will be somewhat af…
2019.01.28 by 이수민 기자
Samsung Electronics Launches 20-Megapixel ISOCELL Slim 3T2, Mass Production to Begin in Q1 of This Year
Samsung Electronics has launched the ISOCELL Slim 3T2, an image sensor that supports 20-megapixel high resolution in a 1/3.4-inch form factor. The ISO…
2019.01.26 by 이수민 기자
ST Launches MOSFET with High-Speed Recovery Body Diode
ST Microelectronics has launched the MDmesh DM6 600V MOSFET featuring a fast-recovery body diode. This product delivers the performance benefits of ST…
2019.01.25 by 이수민 기자
ZEISS Launches Three High-Resolution Image Processing Solutions for 3D Semiconductor Packaging Defect Analysis
Zeiss has announced three high-resolution 3D X-ray imaging solutions for failure analysis of advanced semiconductor packages, including 2.5/3D and fan…
2019.01.23 by 이수민 기자
"The Future of Semiconductors Drawn by AI" Semicon Korea 2019 Held at Record-Breaking Scale
As AI becomes the foundation of all industries, and diverse issues such as smart manufacturing, machine learning, and autonomous driving emerge, winds…
2019.01.23 by 이수민 기자
Efficient battery manufacturing processes increase EV production volume
Despite high battery costs, the share of battery-powered vehicles in total vehicle sales is projected to increase from currently less than 1% to as mu…
2019.01.22 by 이수민 기자
Infineon Selected as Hyundai-Kia Motors '2018 Supplier of the Year,' “First Among Semiconductor Companies”
The drivetrain of a full hybrid or plug-in hybrid electric vehicle requires power semiconductors that are 19 times higher than those in conventional a…
2019.01.22 by 이수민 기자
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Nordic Supplies SoC for SoluM Bluetooth LE Air Quality Monitor
Nordic Semiconductor announced that Soluem, a domestic electronics specialist, has adopted Nordic's nRF52832 SoC for Bluetooth LE wireless connectivit…
2019.01.21 by 이수민 기자
Infineon and TT Tech Auto offer a second-generation solution to enhance the safety of Level 3, 4, and 5 autonomous driving.
Infineon and T-Tech Auto provide a second-generation fully integrated automotive safety solution for autonomous driving use cases. This solution is ba…
2019.01.16 by 이수민 기자
Maxim Launches PPG-ECG Integrated Biosensor Module for Compact Healthcare Applications
Maxim Integrated has introduced the MAX86150. The MAX86150 comprises an integrated LED, photodetector, and ECG analog front-end (AFE), enabling low-po…
2019.01.16 by 이수민 기자
ams launches spectral sensor AS7341 with 11 channels
ams has launched an ultra-compact spectrum sensor chip that delivers expert-level multi-channel color analysis performance to portable devices. The AS…
2019.01.15 by 이수민 기자