Deca, IBM Collaboration Expands North American High-Density Fan-Out Interposer Manufacturing
Deca Technologies (hereinafter "Deca"), a global leader in semiconductor packaging technology, has entered into an agreement with IBM to implement Dec…
2025.05.21 by 명세환 기자
Applied Materials CEO Prabhu Raja: "Collaboration through EPIC Centers will double semiconductor innovation."
Prabu Raja, president of the Semiconductor Products Group at Applied Materials, delivered a keynote speech at Semicon Korea 2025 held on the 19th, pre…
2025.02.25 by 배종인 기자
Coolike & Sofa, “Actively Targeting the Korean Market with Innovative Semiconductor Packaging Technologies, Including Fluxless TCB”
Global semiconductor equipment company Kulicke & Soffa (K&S) announced that it will actively pursue the Korean market by leading with various semicond…
2025.02.18 by 배종인 기자
Korea's Advanced Semiconductor Package Securing is a Critical Matter...New R&D Plan for Process Equipment Revealed
The global semiconductor manufacturing equipment market continues to grow. According to a Markets and Markets market research report, the semiconducto…
2024.12.04 by 권신혁 기자
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SK Hynix Vice President Lee Kang-wook's confidence... "HBM = Hynix's best memory"
The critical keyword in the AI era is large-scale data processing. From next-generation HBM4 onwards, we are preparing for changes through hybrid bond…
2024.10.25 by 권신혁 기자
“SK Hynix to launch HBM4 12-layer in 2025”
Lee Kang-wook, Senior Vice President of SK Hynix (in charge of PKG Development), delivered a presentation at SEMICON TAIWAN on the 3rd with the theme …
2024.09.04 by 배종인 기자
“Magnetic Package, Heat, Power, EMI Advantages...Designer Inductor Concerns↓”
Size issues play a significant role in power design. In response, magnetic packaging (MagPack) technology has been unveiled, which can enhance EMI adv…
2024.09.02 by 권신혁 기자
Semiconductor Package Fab Automation...Samsung Electronics Logistics Automation Achieves 99%
The semiconductor industry is experiencing heightened crisis awareness due to the long-term domestic population decline and rising manufacturing labor…
2024.08.28 by 권신혁 기자
ZEISS Korea to Participate in Next-Generation Semiconductor Packaging Industry Exhibition 2024
Global optical company ZEISS Korea (CEO Jung Hyun-seok) will participate in the 18th Next-Generation Semiconductor Packaging Equipment & Materials Ind…
2024.08.21 by 배종인 기자
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Machinery and Materials Research Institute, Nano-Chemical Research Institute, Join Hands for 300mm Semiconductor Packaging Infrastructure
The Korea Institute of Machinery and Materials (President Ryu Seok-hyun) and the National Nano Fabrication Center (President Park Heung-su) have joine…
2024.08.01 by 배종인 기자
Intel Implements Industry's First Fully Integrated Optical I/O Chiplet
Intel has achieved an innovative milestone by implementing the industry's first fully integrated optical input/output (I/O) chiplet for scalable AI in…
2024.06.27 by 배종인 기자
Semiconductor R&D of 677.5 Billion Won Passes Preliminary Feasibility Study
The Ministry of Science and Technology Information and Communications (Minister Lee Jong-ho) held the '2024 5th National Research and Development Proj…
2024.06.27 by 배종인 기자
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Samsung Electronics to begin mass production of 1.4nm chips and provide a one-stop AI solution by 2027
Samsung Electronics is stepping up efforts to provide AI semiconductor one-stop solutions by mass-producing 1.4-nanometer process technology in 2027 a…
2024.06.13 by 배종인 기자
Nepes aggressively targets AI semiconductors with 8-layer RDL interposer technology.
Netpass is aggressively targeting the inference artificial intelligence market, which has significant growth potential, with its new 8-layer RDL inter…
2024.06.05 by 배종인 기자
SK Hynix Vice President Lee Kang-wook Receives IEEE Electronics Packaging Society Award
A Korean has received the Electronics Manufacturing Technology Award for the first time from the Institute of Electrical and Electronics Engineers (IE…
2024.05.31 by 명세환 기자