Chairman Chey Tae-won Strengthens AI Cooperation with Nvidia
SK Group Chairman Chey Tae-won attended 'GTC Taipei 2026' held in Taiwan to review Nvidia's AI technology roadmap and examine cooperation directions. …
2026.06.02 by 배종인 기자
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SK Hynix Unveils HBM Internal Cooling Technology… AI Response to Memory Heat
SK Hynix has unveiled 'iHBM' technology, which incorporates cooling elements inside the HBM package. This technology forms a separate heat dissipation…
2026.05.26 by 배종인 기자
Measurement in the HBM era: The key is whether the measurement changes the signal.
According to Mohamed Hafed, CEO of Introspect Technology, who presented next-generation DDR/LPDDR memory analysis solution (Introspect) at the e4ds & …
2026.05.22 by 배종인 기자
SEMI: “Semiconductor materials market reaches $73.2 billion… all-time high”
SEMI announced that global semiconductor materials market revenue reached a record high of $73.2 billion in 2025. Both wafer fab materials and packagi…
2026.05.13 by 배종인 기자
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SK Hynix Wins First IEEE Corporate Innovation Award… Recognized for HBM Technology Achievements
SK Hynix has received the Corporate Innovation Award at the '2026 IEEE Awards'. The award was primarily attributed to the company's contribution to th…
2026.04.27 by 배종인 기자
SK Hynix Showcases AI Memory Technology at NVIDIA GTC 2026
SK Hynix will participate in 'NVIDIA GTC 2026' held in San Jose, California from the 16th to the 19th, showcasing core technologies for AI infrastruct…
2026.03.17 by 배종인 기자
Applied Materials and SK Hynix Partner to Develop Next-Generation AI Memory
As competition intensifies in the development of high-performance memory, a critical component in the AI era, Applied Materials and SK Hynix have join…
2026.03.11 by 배종인 기자
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AI will spread to smartphones, robots, and wearables after 2028.
As the artificial intelligence (AI) era advances, structural changes in the global semiconductor industry are accelerating. High-value-added memory su…
2026.02.23 by 배종인 기자
SK Hynix Unleashes Innovations, Including HBM4, LPDDR6, and 321-Layer QLC
SK Hynix showcased its position as a leading provider of differentiated memory solutions tailored to AI-era demands at CES 2026, unveiling AI-optimize…
2026.01.06 by 명세환 기자
SK Hynix Wins Two GSA Awards 2025 Awards
SK Hynix won both the "Best Financial Management Semiconductor Company Award" and the "Excellence Asia Pacific Semiconductor Company Award" at the 'GS…
2025.12.09 by 명세환 기자
"Future data centers require decentralized, high-efficiency, and high-density infrastructure innovation."
At the 13th AI Semiconductor Forum breakfast seminar, KTNF CEO Lee Jung-yeon delivered a presentation titled "Next-Generation Data Center Architecture…
2025.11.12 by 배종인 기자
SK Hynix: "We Will Become a Key Player in AI Memory, Even in Next-Generation NAND Storage"
SK Hynix participated in the '2025 OCP (Open Compute Project) Global Summit' held in San Jose, California, and announced its next-generation NAND stor…
2025.10.27 by 명세환 기자
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Samsung and OpenAI Begin Collaborating on Global AI Infrastructure
Samsung has signed a Letter of Intent (LOI) with OpenAI, a leading global AI company, to build global AI core infrastructure, and is moving forward wi…
2025.10.02 by 배종인 기자
SK and OpenAI partner to innovate across the entire technology cycle, from chip development to data center operations.
SK Chairman Chey Tae-won and OpenAI CEO Sam Altman sign a Letter of Intent (LOI) for memory supply and a Memorandum of Understanding (MOU) for establi…
2025.10.02 by 명세환 기자
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“AI Semiconductor Accelerates Evolution Centered on High-Bandwidth, High-Integrity, and Low-Power DRAM”
Son Gyo-min, Master at Samsung Electronics, presented on "DRAM Solutions in the AI Era" at the "10th Artificial Intelligence Semiconductor Forum Break…
2025.05.13 by 배종인 기자