EVG Supports Resolution of CPO Manufacturing Challenges for AI Data Centers
As the importance of CPO (Co-Packaged Optics), a high-bandwidth and low-power optical interconnect technology, grows with expanding AI data center dem…
2026.09.02 by 배종인 기자
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EVG Unveils Next-Generation EVG®120 for Mass Production… 40% Improved Throughput and 20% Reduced Installation Footspace
EV Group (EVG) has unveiled the next-generation EVG®120 automatic resist processing system targeting mass production environments. The new platform in…
2026.02.19 by 명세환 기자
EVG Unveils Advanced Memory and Packaging Process Solutions at Semicon Korea 2026
EV Group (EVG) will participate in 'Semicon Korea 2026' held at Seoul COEX from February 11 to 13, showcasing key process technologies for advanced me…
2026.02.10 by 배종인 기자
EV Group Leads Innovation in 300㎜ MEMS Manufacturing Technology
EV Group (EVG), a leading company in advanced semiconductor manufacturing and chip integration technology, has announced the next-generation GEMINI® a…
2025.03.19 by 배종인 기자
EVG Responds to Future Chip Stacking Needs
EV Group (EVG), providing innovative process solutions and expertise in advanced semiconductor design and chip integration methods, will present techn…
2025.02.18 by 배종인 기자