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Rohm Develops VCSEL Module Technology Integrating Light Source and Driving Elements
Rohm has developed high-power VCSEL module technology that enhances the precision of spatial recognition and distance measurement systems. VCSEL modul…
2020.09.02 by 이수민 기자
ST Adds QFN48 Package Option to STM32WLE5 RF SoC
ST Microelectronics has added a QFN48 package option to its STM32WLE5 wireless SoC portfolio to support diverse industrial wireless applications. Base…
2020.09.01 by 강정규 기자
Dassault Systèmes and the Ministry of SMEs and Startups Step Up to Foster Domestic Manufacturing Startups
The Ministry of SMEs and Startups will implement the "Da-On-Da" program in cooperation with Dassault Systèmes to foster startup companies in the domes…
2020.08.31 by 강정규 기자
KT Develops Short-Range 3D LiDAR Prototype with High Price Competitiveness
KT announced the development of an indoor short-range 3D LiDAR. The manufacturing cost is approximately one-tenth that of existing products, and a sin…
2020.08.31 by 이수민 기자
Nokia and LS Electric to collaborate in APM
LS Electric has signed a memorandum of understanding with Nokia to jointly develop power equipment asset management solutions. The two companies plan …
2020.08.28 by 이수민 기자
Strong, flexible soft robots made with 3D printers
When manufacturing soft robots, relying solely on the inherent soft properties of materials makes it difficult to implement complex robotic actuation …
2020.08.27 by 이수민 기자
ETRI's on-device vision processing software obtains OpenVX certification.
ETRI has announced that it has developed high-performance, low-power vision processing software for on-device applications and obtained OpenVX standar…
2020.08.26 by 이수민 기자
Schneider Electric Unveils Three Power Supplies for KEC
Schneider Electric has unveiled new Modicon power supply products. The lineup is available in three types tailored to different applications: Modular …
2020.08.21 by 이수민 기자
Microchip Unveils Transceiver Supporting CXP 2.0 Standard
Microchip has launched the EQCO125X40 transceiver, which supports the CoaXPress 2.0 standard for machine vision camera interfaces. As a single-chip pr…
2020.08.20 by 이수민 기자
Edge Computer Launched to Implement AIoT in Harsh Environments
Moxa has launched the MC-1220 series edge computer. The MC-1220 series is equipped with Intel Core i7/i5/i3 processors and multiple expansion interfac…
2020.08.13 by 이수민 기자
Pre-orders for "Twice as Large" Formlabs 3D Printer 'Form 3L' Begin in Korea
Elco Corporation is beginning pre-orders for Formlabs' Form 3L 3D printer. The Form 3L, which is larger than the existing Form 3 and enables a wider v…
2020.08.13 by 강정규 기자
ETRI Unveils Three Infrastructure Technologies to Boost Solar Energy Utilization
ETRI has developed infrastructure-based technology for efficiently managing solar energy and utilizing it at appropriate locations, as well as commerc…
2020.08.12 by 이수민 기자
Teledyne Announces ToF CMOS Image Sensor for 3D Sensing
Teledyne e2v has announced Hydra3D, a ToF CMOS image sensor for 3D sensing and distance measurement. The new sensor, which features a 10μm 3-tap pixel…
2020.08.12 by 강정규 기자
ST to Freely Distribute Industrial Monitoring AI Device SW Function Pack
ST has released the STM32 software function pack for free to implement, train, and deploy intelligent edge devices for industrial condition monitoring…
2020.08.12 by 이수민 기자
Telit's Industrial 5G Data Card Achieves Multiple Global Certifications
Telit announced that its industrial LTE-A/5G data card series, FN980, has passed FCC, PTCRB, RED, GCF, JRL, JTBL, and KC certifications. With the acqu…
2020.08.12 by 이수민 기자