전체기사9,076건
AnaFlash Receives $500K in Additional Funding from NSF
Anaflash announced on the 21st that it has received an additional 500,000 USD in Phase 2 Small Business Innovation Research (SBIR) funding from the U.…
2023.09.21 by 명세환 기자
Cytime: “MEMS-based OCXO to Change the Landscape of Precision Timing Technology”
SiTime Corporation, a specialist in high-precision timing solutions, announced the SiTime Epoch Platform on the 20th. Vice President Jeff stated, "SiT…
2023.09.20 by 김예지 기자
u-blox reduces data bandwidth by up to 70%.
Ublox is deploying an enhanced version of its PointPerfect GNSS correction service, the Ublox PointPerfect Localized Distribution, which expands the f…
2023.09.20 by 배종인 기자
Intel: “The Next Step After Moore’s Law Is Multi-Chiplet Packaging”
Intel held its third annual Intel Innovation developer event in San Jose, California, and unveiled a variety of technologies designed to enhance acces…
2023.09.20 by 배종인 기자
SK Hynix, Rolling Recruitment of New Employees for the Second Half of the Year
Although the semiconductor industry is in a downturn, the future semiconductor industry is facing a critical need for continuous talent recruitment dr…
2023.09.20 by 명세환 기자
Merck Shares Digital Solutions for the Semiconductor Industry at the Adecco Conference
Merck shared its perspectives on artificial intelligence and machine learning fields, as well as semiconductor industry trends, at the integrated acad…
2023.09.20 by 배종인 기자
AMD Launches Kria K24 SOM and Starter Kit, Accelerating Edge Innovation
AMD has launched a new solution for computing-intensive edge DSP applications. The new AMD product is drawing attention, with expectations for high ut…
2023.09.19 by 명세환 기자
ST Launches MCU Discovery Kit to Support Rapid Implementation of Connected Devices
ST has launched products that deliver high-performance processing and security features across diverse applications including smart sensors, smart hom…
2023.09.19 by 성유창 기자
Intel Unveils Next-Generation Packaging 'Glass Substrate' Technology
The semiconductor industry is seeking answers in next-generation advanced packaging to achieve Moore's Law. Intel has found a clue in 'glass' material…
2023.09.19 by 명세환 기자
SK Hynix Unveils Prototype of GDDR6-AiM-Based Generative AI Accelerator
Generative AI produces superior results as the volume of training data increases, making memory that operates with low power consumption and high spee…
2023.09.18 by 명세환 기자
Intel Expands FPGA Portfolio
Intel is expanding its Intel Agilexⓡ FPGA portfolio through 2030 and broadening its Programmable Solutions Group (PSG) product family to meet requirem…
2023.09.15 by 배종인 기자
[Technical Contribution] Benjamin Reiss: Considerations When Selecting a MEMS Accelerometer for ADI-CbM
Let's hear from Benjamin Reiss of Analog Devices, Inc. about important considerations when selecting a MEMS accelerometer.
2023.09.14 by 명세환 기자
Microchip, Subsidiaries SST and IHWK Collaborate to Accelerate Edge AI
Microchip is creating synergy through collaboration between its subsidiary SST and Intelligent Hardware Korea to develop a computing platform that sup…
2023.09.14 by 명세환 기자
Korea's non-memory global market share is only 3.3%
South Korea's non-memory semiconductor market share globally stands at only 3.3%, which is one-third of Japan's and one-half of China's, and this mark…
2023.09.13 by 배종인 기자
Apple Unveils iPhone 15 Series...Domestic Release Date Undecided
The iPhone 15 series has been unveiled. The main features of this series include △ USB-C charging port adoption △ removal of the 'M-shaped' notch at t…
2023.09.13 by 김예지 기자