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Bycor presents xEV design innovation with ultra-small and ultra-light power modules
Vicor will present at the 12th AID 2023 (Automotive Innovation Day), a premium automotive event to be held on July 6th at the Geomungo Hall of The K H…
2023.06.22 by 배종인 기자
KIMM Develops Next-Generation Semiconductor Large-Area Etching Technology
Next-generation two-dimensional semiconductor process technology, which offers superior performance and reduced power consumption compared to silicon-…
2023.06.22 by 배종인 기자
IAR, IAR Embedded Workbench 9.40 Code Security Performance Improvements
IAR Embedded Workbench 9.40 fully complies with the PACBTI extension specification, providing complete protection for embedded applications against se…
2023.06.21 by 배종인 기자
Nuvoton and Seger Expand Collaboration on Embedded Software Development
Global chip makers are accelerating efforts to establish a time and cost-efficient development tool ecosystem. In particular, the MCU industry is focu…
2023.06.21 by 명세환 기자
SK Hynix to Host 2023 SK Global Forum in Silicon Valley
SK Hynix will host the '2023 SK Global Forum' in San Jose, the heart of Silicon Valley in California, from the 22nd to the 25th.
2023.06.21 by 배종인 기자
SK Hynix Receives International Certification for Automotive Memory Quality
SK Hynix has obtained Automotive SPICE (ASPICE) Level 2 (CL2, Capability Level 2) certification.
2023.06.20 by 배종인 기자
Intel Unveils 12-Qubit Quantum Computing Chip, "Tunnel Falls"; Demonstrates Leadership in Quantum Research
Quantum computing is showing signs of entering the quantum utility phase in earnest, where it can overwhelm the performance of conventional supercompu…
2023.06.19 by 명세환 기자
Nordic Launches Low-Cost Wi-Fi 6 Solution for Optimal Cost Design
Nordic Semiconductor expands the nRF70® series with the introduction of nRF7001™, a new Wi-Fi 6 companion IC designed for low-power Wi-Fi IoT products…
2023.06.19 by 배종인 기자
Materials Research Institute, World's First Development of Next-Generation Wearable Edge Neuromorphic Computing Semiconductor Devices
The Korea Institute of Materials Science (KIMS, Director Lee Jung-hwan), a government-funded research institute under the Ministry of Science and ICT,…
2023.06.19 by 배종인 기자
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Intel Launches New Intel® Core™ Ultra and Intel Core Processor Brands
Intel has announced significant changes to client computing branding, including the launch of the new Intel® Core™ Ultra and Intel Core processor bran…
2023.06.16 by 배종인 기자
DeepX participates in Computex Taiwan and wins InnoVEX award, accelerating its expansion into Taiwan.
DeepX, which possesses indigenous AI semiconductor core technologies, participated in Computex, Taiwan's largest IT exhibition, accelerating its effor…
2023.06.16 by 명세환 기자
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[Technical Contribution] ADI Tong Anthony Huin - Why Optocouplers Are Unnecessary for Isolated DC-DC Conversion
ADI's Thong Anthony Huynh explains how to solve design challenges related to isolated DC-DC conversion without using optocouplers.
2023.06.16 by 명세환 기자
Cadence Provides Fast Path to Mobile Chip Tapeout Using ARM TCS23
Cadence Design Systems (hereinafter Cadence) announced on the 13th that it will strengthen its ongoing collaboration with ARM for successful tapeout o…
2023.06.14 by 명세환 기자
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Semiconductor equipment sales in Q1 increased 9% year-on-year.
Global semiconductor equipment sales in the first quarter of 2023 showed nearly 10% growth compared to the same period of the previous year, driven by…
2023.06.14 by 배종인 기자
“New semiconductor models, new materials, new structures: 3 new, basic science-based essential”
In an era of global competition for advanced industry dominance, there have been calls emphasizing that Korea's foundation in basic science must be st…
2023.06.13 by 명세환 기자