전체기사9,076건
SK Hynix Verified 5th-Generation DDR5 Data Center Compatibility
SK Hynix has completed development of its 5th generation (1b) 10-nanometer-class technology, the most advanced DRAM miniaturization to date, and has b…
2023.05.30 by 배종인 기자
Supermicro to Expand AI and Data Infrastructure at Computex 2023
As companies are making all-out efforts to build high-performance AI infrastructure, energy efficiency, cost-effectiveness, flexibility, and rapid dep…
2023.05.30 by 명세환 기자
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ST, “Stella MCU Suitable for Automotive Zone and Domain Architectures”
ST Microelectronics (hereinafter referred to as ST) has introduced Stellar, a next-generation MCU capable of meeting the requirements of automotive do…
2023.05.30 by 성유창 기자
National Museum of Korea Transparent OLED Demonstration
The government has initiated an exhibition at the National Museum of Korea featuring transparent organic light-emitting diode (OLED) displays, opening…
2023.05.30 by 배종인 기자
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[Interview] Lim Ha-ni, CEO of Roa Intelligence, “Fabless, AI Turbulence Era Must Explore New Edge Devices”
The era of artificial intelligence proliferation has arrived. Companies sensitive to trends are already rapidly integrating AI capabilities into their…
2023.05.26 by 명세환 기자
AMD Launches Automotive-Grade Product Family Supporting Automotive Edge Sensors
AMD has launched a product that meets the key requirement of functional safety while addressing rapid signal processing, cost reduction, and miniaturi…
2023.05.25 by 성유창 기자
Intel Launches Agilex7 FPGA with R-Tile
Various industries including data centers, telecommunications, and financial services, facing constraints in time, budget, and power consumption, are …
2023.05.25 by 명세환 기자
Semiconductor Packaging Materials Market to be Worth $30 Billion by 2027
The global semiconductor packaging materials market is projected to grow at a compound annual growth rate of 2.7% and reach approximately $30 billion …
2023.05.24 by 배종인 기자
Intel and Microsoft Unveil Meteor Lake AI Capabilities
The PC industry is at a significant inflection point. Intel and Microsoft have stepped up collaboration to deliver new AI-enabled capabilities to the …
2023.05.24 by 명세환 기자
[Interview] Seo Pil-gi, ST Vice President - “ST TOF Sensor, Low Power, Small Size, Uniform Distance Performance Satisfaction”
Our publication will hold a webinar titled "Introduction to FlightSense VL53L8CX" on June 15th, where you can learn about the functionality, innovatio…
2023.05.24 by 성유창 기자
Applied Materials Invests Billions of Dollars in R&D Platform in Silicon Valley
Applied Materials is investing billions of dollars in an R&D platform that enables early access to next-generation processes and equipment for semicon…
2023.05.24 by 배종인 기자
Jensen Huang: "Chip manufacturing is ideal for accelerated computing and AI."
"Chip manufacturing is an 'ideal application' for accelerated computing and AI computing," said Nvidia during a video presentation on the roles of acc…
2023.05.24 by 명세환 기자
ASM, $100 million investment in Mars 2nd Manufacturing Research Innovation Center begins in earnest
ASM, a global semiconductor company from the Netherlands, is investing $100 million in Hwaseong, Gyeonggi Province, to expand its R&D and manufacturin…
2023.05.23 by 배종인 기자
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Generative AI AI War, “AI Chip Demand Explosion”
Generative AI service products such as ChatGPT and Midjourney are attracting market attention. In this context, domestic artificial intelligence exper…
2023.05.23 by 명세환 기자
Samsung Electronics Mass-produces Industry's Most Advanced 12nm-Class DRAM
Samsung Electronics has begun mass production of 16Gb (gigabit) DDR5 DRAM using an industry-leading 12-nanometer process node, solidifying its technol…
2023.05.22 by 배종인 기자