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ROHM Unveils AC/DC Converter with Integrated 1700V SiC MOSFET
Auxiliary power supplies for high-power industrial equipment have faced difficulties in achieving low power consumption due to the adoption of low bre…
2021.06.17 by 이수민 기자
ST Announces World's First G3-PLC Hybrid Certified Chipset
The G3-PLC hybrid specification enables smart grid, smart city, and industrial/IoT devices to automatically and dynamically select appropriate wireles…
2021.06.17 by 이수민 기자
Key Foundry and Above Semiconductor Join Forces for Automotive Semiconductor
Keyfoundry provides Above Semiconductor with a second-generation flash memory embedded 0.13 micron BCD (Bipolar-CMOS-DMOS) process suitable for automo…
2021.06.17 by 배종인 기자
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Merck Begins Full-Scale Training of Semiconductor and Display Talent, Leading the Way in ESG
Merck Korea (CEO Dr. Kim Woo-kyou), the Korean subsidiary of leading science and technology company Merck, is taking the lead in ESG initiatives by pr…
2021.06.17 by 배종인 기자
FLIR Thermal Camera Adopted in Protec's Advanced Semiconductor Packaging Equipment
Teledyne FLIR Korea (Branch Manager Lee Hae-dong) announced on the 16th that its FLIR A315 thermal camera has been adopted in advanced LAB (laser-assi…
2021.06.16 by 명세환 기자
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ST Completes China's MI Smart Lock Using MCU and Security Technology
Magic Information's smart lock solution utilizes AIoT fingerprint recognition technology running on ST's STM32WB55 Bluetooth® LE microcontroller (MCU)…
2021.06.16 by 강정규 기자
Infineon Launches Two New OptiMOS™ Power Semiconductor Products
Infineon Technologies (Chief Executive Officer Lee Seung-soo, Korea) has unveiled a new power MOSFET package that meets diverse design requirements of…
2021.06.16 by 명세환 기자
Samsung Electronics Launches New uMCP Products, Incorporating DRAM and NAND in a Single Chip
Samsung Electronics has enhanced design convenience and space utilization for smartphone manufacturers through the launch of a high-performance uMCP n…
2021.06.15 by 배종인 기자
KAIST Boosts Communication Chip Performance with Semiconductor 3D Stacking Technology
A research team led by Professor Kim Sang-hyun from the Department of Electrical and Electronic Engineering at KAIST has developed monolithic three-di…
2021.06.15 by 이수민 기자
Output current can be increased by connecting LDO regulators in parallel.
Power supply designers can connect LDO regulators in parallel to increase supply current capacity even in limited space and mitigate heat dissipation.…
2021.06.15 by 이수민 기자
Samsung Electronics Recruits Participants for University Student Programming Contest
Samsung Electronics' College Student Programming Competition (SCPC) will accept participant applications on the Samsung Research website from June 15t…
2021.06.14 by 명세환 기자
May ICT Exports Reach $17.7 Billion… Second Highest Ever for May Exports
May ICT exports reached $17.73 billion, recording a 27.4% increase compared to the same period last year, achieving the second-highest May export figu…
2021.06.14 by 배종인 기자
Telit 'LM960A18' Module Passes U+ LTE '3CA' Certification
Telit announced that its LM960A18 module has received LTE network certification from LG U+. The LM960A18 product, provided in an mPCIe data card form …
2021.06.14 by 강정규 기자
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Arm Announces Two MCU Solutions to Boost IoT Device Compatibility
Most things in the Internet of Things (IoT) are composed of MCU-based devices. Accordingly, ensuring software compatibility for component reuse has be…
2021.06.14 by 이수민 기자
TSMC Approves Investment of Approx. 10.3 Trillion Won
TSMC has approved a new investment of approximately KRW 10.2766 trillion and is proceeding with capacity expansion and facility investment.
2021.06.11 by 배종인 기자