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Xiaomi's in-house AP development aims to become China's leading smartphone manufacturer.
Xiaomi, which jumped to the third-largest global smartphone vendor in 2020, has announced plans to develop its own smartphone AP. Interest is focusing…
2021.03.29 by 배종인 기자
Samsung Electronics Develops 512GB DDR5 Module, "Expected to Launch in Second Half"
The next-generation DRAM specification, DDR5, delivers twice the performance of DDR4. With data transfer speeds reaching approximately 7200Mbps, it ca…
2021.03.29 by 이수민 기자
Simultaneously implementing enhanced security and TCO optimization in IIoT solutions.
IIoT applications are evolving from reliable IoT systems to security-enhanced IoT systems. Security-enhanced IoT solutions consist of numerous individ…
2021.03.28 by 이수민 기자
Will the ongoing semiconductor supply and demand instability change the foundry landscape?
The shortage of automotive semiconductors stems from major automotive semiconductor manufacturers' failed demand forecasts, who anticipated reduced au…
2021.03.27 by 이수민 기자
Ultra-fine device manufacturing process, atomic layer deposition, lowers costs.
Semiconductor chips contain up to billions of transistors and diodes. These microscopic devices exist in the form of patterns drawn within multiple la…
2021.03.24 by 이수민 기자
Intel's New CEO Makes First Move: "Establishes New Foundry Division"
Intel is constructing two new fabs and launching full-fledged foundry operations. Pat Gelsinger, Intel's new CEO, stated that Intel is the only compan…
2021.03.24 by 이수민 기자
Maxim Unveils Two New DC-DC Step-Down Converters with Reduced Board Space
Maxim Integrated has launched the MAX17577 and MAX17578, synchronous inverting DC-DC step-down converters. The two new converters integrate level-shif…
2021.03.23 by 이수민 기자
Fab equipment boom returns, with double-digit growth expected through 2022.
SEMI stated that as demand for electronic products surges due to the widespread adoption of non-face-to-face trends following COVID-19, investment in …
2021.03.22 by 이수민 기자
Xilinx Expands 16nm FPGA Product Family to Support Edge Computing
Xilinx has expanded its cost-effective Ultrascale+ portfolio to support ultra-compact, high-performance edge computing. The Artix and Zynq Ultrascale+…
2021.03.19 by 이수민 기자
Infineon Unveils 2nd Generation StrongIRFET 80/100V MOSFET
Infineon has unveiled StrongIRFET 2, its next-generation 80V and 100V power MOSFET technology. It is optimized for both low and high switching frequen…
2021.03.19 by 강정규 기자
UnitedSiC Offers Online Power Design Verification Evaluation Tool
UnitedSiC has launched the FET Jet Calculator. Users can now evaluate the performance of all UnitedSiC FETs and Schottky diodes across various power a…
2021.03.19 by 강정규 기자
Toshiba Ships Lens-Reduction CCD Linear Image Sensors
Demand for A3 multifunction devices capable of high-speed scanning is increasing. In response, Toshiba has launched the TCD2726DG, a lens-reduction CC…
2021.03.18 by 강정규 기자
12-inch Semiconductor Small Business Testbed Officially Launches
Domestic semiconductor material, parts, and equipment (materials, parts, equipment) companies have faced significant challenges due to the absence of …
2021.03.17 by 이수민 기자
Optimizing Power Supply Efficiency Using a 6-Phase Buck Controller
Processors used in communications, server, and computing systems require core power supplies that deliver load currents exceeding 200A. These systems …
2021.03.17 by 이수민 기자
Intel Launches Easy-to-Overclock 'Rocket Lake S' Processor
Intel has launched the 11th generation Intel Core S series desktop processors. This processor, codenamed Rocket Lake-S, is based on the Cypress Cove a…
2021.03.17 by 이수민 기자

