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The race for next-generation DRAM, DDR5, has begun: "2021 will be the start of a fierce battle in 2022."
JEDEC officially announced the standard specifications for DDR5, the next-generation DRAM, in July. Samsung Electronics and SK Hynix, the two global m…
2020.11.02 by 이수민 기자
WD and Dropbox to Unveil Low-Cost 'SMR HDD'
Dropbox utilizes Western Digital's SMR HDD at the exabyte scale. Through this, it provides service to more than 600 million online customers. The Ultr…
2020.11.02 by 김동우 기자
Nordic SoCs Adopted for BLE Modules for "Temperature-Sensitive" IoT Devices
Nordic Semiconductor announced that its nRF52833 and nRF52810 low-energy Bluetooth modules have been adopted for the core processing performance and w…
2020.11.02 by 이수민 기자
LG Electronics sets new record for Q3 results, with operating profit approaching KRW 1 trillion.
With demand for home appliances and TVs recovering in the third quarter after slowing in the first half due to COVID-19, LG Electronics recorded conso…
2020.11.02 by 김동우 기자
"SEDEX 2020," the largest-ever next-generation semiconductor competition
The 22nd Semiconductor Exhibition (SEDEX 2020) concluded on the 30th, completing a four-day event. This year, led by Samsung Electronics and SK Hynix,…
2020.11.02 by 이수민 기자
Toshiba begins shipping 32 LDOs suitable for mobile devices.
Toshiba announced the launch and shipment of 32 new LDO regulators in the TCR3RM series on the 30th, which stabilize DC power line outputs for mobile …
2020.10.30 by 이수민 기자
'3D Image Sensor' Capable of Implementing AR 10m Ahead to Be Released
Infineon Technologies and pmd technologies' 3D depth sensor based on ToF (Time of Flight) technology delivers innovative consumer convenience with sup…
2020.10.30 by 김동우 기자
STMicroelectronics Launches All-in-One Multi-Zone Direct ToF Module
This device comprises a 940nm VCSEL light source, an SoC sensor integrating a VCSEL driver, a SPAD receive array, a low-power 32-bit MCU core, and an …
2020.10.30 by 김동우 기자
Mouser to Supply Integrated OB1203 Biosensor Module
The OB1203 sensor module combines biosensor, ambient light sensor, proximity sensor, and color sensor in an integrated solution, delivering a highly i…
2020.10.30 by 강정규 기자
'NXP NTAG' applied to Xiaomi IoT stickers for smart home
NXP Semiconductors announced that its NTAG technology has been adopted in Xiaomi's recently launched Pongpong Tile 2.0 sticker. Users can configure a …
2020.10.29 by 이수민 기자
Shenzhen Airport-Building the 'Airport of the Future' with Huawei UPS
Shenzhen Airport has selected Huawei as a partner for the core project "Future Airport Phase II Implementation: Uninterruptible Power Supply (UPS) Sys…
2020.10.29 by 강정규 기자
Silicon Labs Strengthens Isolated Gate Driver Family
Silicon Labs announced the launch of new Si823Hx/825xx isolated gate drivers. The product is characterized by a combination of faster and safer switch…
2020.10.28 by 강정규 기자
The Next Generation Convergence Technology Research Institute Opens a Central Analysis Support Center
The Next-Generation Convergence Technology Research Institute (Director Joo Young-chang, hereinafter referred to as NGCTRI) announced on the 27th (Tue…
2020.10.28 by 강정규 기자
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Schneider Electric Launches New 'EOCR'
Schneider Electric has launched two new electronic over current relay (EOCR) products: 'EOCR PFZ' and 'EOCRSS-400U'. The newly released products suppo…
2020.10.28 by 김동우 기자
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The Future of Sensors, Intelligent Sensors "A Core Component of Smart IT Convergence Services"
As the value of data increases, demand for sensors that convert physical quantities into electrical signals continues to grow. However, increasing the…
2020.10.27 by 이수민 기자