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RF-to-bit development platform accelerating phased array system design
Phased arrays must be implemented in future antenna designs. RF designers working on phased array systems can eliminate the prototyping phase in multi…
2020.09.03 by 이수민 기자
TI Unveils DC/DC Buck-Boost Converter for Smart Meters
TI's TPS63900 DC/DC buck-boost converter, suitable for smart metering applications, features a standby current as low as approximately 75nA and allows…
2020.09.02 by 강정규 기자
Rohm Develops VCSEL Module Technology Integrating Light Source and Driving Elements
Rohm has developed high-power VCSEL module technology that enhances the precision of spatial recognition and distance measurement systems. VCSEL modul…
2020.09.02 by 이수민 기자
Quantum sensors surpassing classical sensors, a precursor to the advancement of quantum technology
Quantum sensing is a sensing and imaging technology that precisely measures minute signals that cannot be detected by classical systems by utilizing t…
2020.09.01 by 이수민 기자
ST Adds QFN48 Package Option to STM32WLE5 RF SoC
ST Microelectronics has added a QFN48 package option to its STM32WLE5 wireless SoC portfolio to support diverse industrial wireless applications. Base…
2020.09.01 by 강정규 기자
Microchip Unveils Solution to Simplify SiC Power Component Development
Microchip has announced an "AgileSwitch digital programmable gate driver and SP6LI SiC power module kit solution" that enables rapid development of Si…
2020.09.01 by 명세환 기자
Samsung Electronics Ships First EUV Process-Applied DRAM at Pyeongtaek Line 2
Samsung Electronics announced the commencement of operations at Pyeongtaek Line 2, the world's largest semiconductor production line. The line will pr…
2020.08.31 by 이수민 기자
Wireless charging of two smartphones simultaneously in a vehicle is now possible
NXP Semiconductors has announced the MWCT2xx3A series, a family of automotive multi-device 15W wireless charging transmitter ICs driven by a single MW…
2020.08.28 by 명세환 기자
Toshiba Launches Three Ultra-Compact Photorelays for High-Temperature Operation
Toshiba has launched three new photocoupler products. The TLP3407SRA, TLP3475SRHA, and TLP3412SRHA all have a maximum operating temperature of 125°C, …
2020.08.28 by 강정규 기자
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MCU Market Hit Hard by COVID-19 to Recover Starting Next Year
MCUs have emerged as the major IC product most severely impacted by the COVID-19 pandemic. According to IC Insights, global MCU sales this year are ex…
2020.08.28 by 이수민 기자
Strong, flexible soft robots made with 3D printers
When manufacturing soft robots, relying solely on the inherent soft properties of materials makes it difficult to implement complex robotic actuation …
2020.08.27 by 이수민 기자
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Mouser to Supply Panasonic BLE Modules for Remote Control Devices
Mouser Electronics supplies Panasonic's PAN1740A BLE RF module. The PAN1740A module features a fully integrated baseband processor and wireless transc…
2020.08.27 by 이수민 기자
UNIST succeeds in synthesizing flexible semiconductor material "exene" for the first time.
A joint research team from UNIST comprising Professors Park Young-seok, Lee Geun-sik, and Shin Hyung-jun successfully synthesized ixene, one of the po…
2020.08.26 by 이수민 기자
"3D position measurement of an object, 3D Hall sensor is most suitable"
As automation, remote control, and predictive maintenance are being increasingly applied across various industries including automotive, the utilizati…
2020.08.26 by 이수민 기자
Microchip Unveils 4Mbit Serial EEPROM '25CSM04'
Serial EEPROMs store user-specific data sets that optimize the user experience of devices. Microchip has released the 25CSM04, a 4Mbit serial EEPROM w…
2020.08.26 by 강정규 기자