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Keysight Partners with Two German Companies to Develop ADE Platforms
Keysight announced that it has established a multi-year collaborative framework with Germany's IPG Automotive and Nordsys to develop an autonomous dri…
2020.08.26 by 명세환 기자
Element14 to Supply 1,500 Types of KOA Passive Components
Element14 announced on the 24th that it has signed a distribution agreement to supply 1,500 types of passive components from KOA. KOA holds the second…
2020.08.25 by 강정규 기자
ST Korea Holds STM32 Discovery Day Online
ST Korea announced that it will hold 'STM32 Discovery Day Online Track 2020' from September 1st to 4th, showcasing key STM32 products and solutions fo…
2020.08.24 by 이수민 기자
Mouser Provides Resistor Color Calculator Linked to Its Inventory
Mouser Electronics announced that it provides technical materials and tools supporting the entire circuit design process, including a resistor color c…
2020.08.24 by 강정규 기자
31 R&D Projects Selected to Support Commercialization of Materials, Parts, and Equipment Technologies for SMEs
The Ministry of SMEs and Startups has selected 31 projects in the first round for the Tech Bridge Commercialization Technology Development Project, wh…
2020.08.24 by 명세환 기자
"DC/DC converter, peripheral circuit design is important"
Electronic products operating on wall outlet power require an AC/DC converter to convert AC 220V to DC. This is because most ICs operate only on DC. D…
2020.08.21 by 이수민 기자
Xilinx FPGAs Adopted for Stereo Camera-Based ADAS
Xilinx's automotive-grade Zynq UltraScale+ MPSoC has been adopted in the new version of Subaru's vision-based ADAS EyeSight. The adopted device provid…
2020.08.20 by 명세환 기자
Microchip Unveils Transceiver Supporting CXP 2.0 Standard
Microchip has launched the EQCO125X40 transceiver, which supports the CoaXPress 2.0 standard for machine vision camera interfaces. As a single-chip pr…
2020.08.20 by 이수민 기자
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ST Launches 26 1.0mm Profile Schottky Diodes
ST has launched 26 types of Schottky diodes based on SMA·SMB Flat packages with a thickness of 1mm. The profile is 50% lower than standard SMA·SMB pac…
2020.08.19 by 이수민 기자
Maxim DS28E18 Bridge, Supports Expanded Remote Sensor Networks
Maxim has introduced the DS28E18, a 1-Wire-to-I2C/SPI bridge that reduces the cost and complexity of expanding remote sensor network connectivity. The…
2020.08.19 by 명세환 기자
IBM Unveils 'Power10' Processor for Hybrid Cloud
IBM has unveiled the Power10 processor. Optimized for Red Hat software, Power10 is a 7nm process-based processor specialized for enterprise-grade hybr…
2020.08.19 by 강정규 기자
DB HiTek's operating profit soars 98% in the first half of the year, driven by rising demand for power semiconductors and sensors.
DB HiTek reported revenue of 467.5 billion won and operating profit of 141.8 billion won for the first half of this year. This represents a respective…
2020.08.14 by 강정규 기자
Next-generation wearable devices made with graphene
Graphene is a material composed of a single layer of carbon atoms bonded in a hexagonal honeycomb structure on a two-dimensional plane. It has a thin …
2020.08.13 by 이수민 기자
Achieving real-time hardware security requires an FPGA-based solution.
As the proliferation of connected devices accelerates, developers now need to demonstrate that their hardware platforms are protected against cyber th…
2020.08.13 by 이수민 기자
Will the 12-inch wafer-based micro-parts testbed yield results?
Minister Choi Ki-young of the Ministry of Science and ICT visited the on-site location of the 12-inch semiconductor materials, components, and equipme…
2020.08.13 by 이수민 기자