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ON Semi Announces RSL10 Bluetooth Mesh Networking Platform
ON Semiconductor has introduced a new ultra-low-power RSL10 SIP-based low-power Bluetooth mesh networking solution. With the RSL10 mesh platform optim…
2020.06.24 by 강정규 기자
Infineon to Supply Security Platform Suitable for Contactless ID
Infineon supplies the SECORA ID S security platform, which is easy to integrate for contactless digital ID applications. SECORA ID S is a Java-based s…
2020.06.24 by 이수민 기자
Things to Know Before Buying a Switch Mode Power Supply
SMPS switches at a frequency that is fixed, variable, or synchronized to an external clock. The physical size of the device varies depending on the sw…
2020.06.23 by 이수민 기자
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Maxim Launches MAX32670 MCU, Preventing Bit Flipping
Maxim Integrated has launched the MAX32670, a low-power Arm Cortex-M4 MCU with FPU. The MAX32670 protects all memory with ECC functionality to prevent…
2020.06.23 by 강정규 기자
Nordic Unveils BLE SoC nRF52805 with 10 GPIOs
Nordic Semiconductor has announced the nRF52805 Bluetooth 5.2 SoC, the seventh product in the nRF52 series. The nRF52805 Bluetooth LE SoC is offered i…
2020.06.22 by 강정규 기자
Samsung Electronics Supports Korean Fabless Companies with SAFE-CDP Chip Design Platform
Samsung Electronics announced that it will support domestic small and medium-sized fabless companies with SAFE-CDP, a platform that enables semiconduc…
2020.06.19 by 이수민 기자
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Xilinx Unveils Two Video Transcoding Reference Servers
Xilinx unveiled two reference architectures for real-time video server appliances through an online press briefing. The two architectures, which lever…
2020.06.18 by 이수민 기자
Intel begins pre-orders for its D445 IMU-equipped depth camera.
Intel has unveiled the 'Intel RealSense Depth Camera D455'. The D455 features a maximum shooting distance of 20m, which is twice as far as the previou…
2020.06.18 by 명세환 기자
Microchip and Kioxia Successfully Test 24G SAS End-to-End Storage Interoperability
Microchip and Kioxia America have completed end-to-end storage interoperability testing for 24G SAS. The interoperability testing demonstrates that Mi…
2020.06.18 by 이수민 기자
ROHM Develops 1200V 4th-Generation SiC MOSFET with Reduced ON Resistance While Maintaining Short-Circuit Withstand Time
Rohm has developed a 1200V SiC MOSFET that reduces ON resistance without decreasing short-circuit withstand time. The newly developed fourth-generatio…
2020.06.17 by 이수민 기자
Korean company's non-contact thermometer utilizing Thermopile has received FDA approval.
As demand for non-contact thermometers increases due to COVID-19, Tempers has succeeded in mass production of micro infrared sensors for non-contact t…
2020.06.17 by 이수민 기자
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Infineon Launches 'CoolSiC 1700V SMD MOSFET' to Improve High-Voltage Auxiliary Power Supply Efficiency
Infineon Technologies has launched the CoolSiC MOSFET 1700V product. The 1700V surface mount device (SMD) maximizes the physical properties of silicon…
2020.06.17 by 강정규 기자
Kioxia Launches PM6 Series 24G SAS SSDs for Enterprises
Kioxia has launched the PM6 series, an enterprise 24G SAS SSD. The PM6 series, which was first introduced at the Flash Memory Summit 2019, is now avai…
2020.06.16 by 강정규 기자
What You Can Make with a Linux-Running MPU
ST Microelectronics Korea conducted the STM32MP1 Complete Mastery Quest Challenge competition from April 13th to June 14th on e4ds make. The competiti…
2020.06.16 by 이수민 기자
Toshiba Develops Two Types of Industrial CCD Linear Image Sensors
Toshiba has launched new products TCD1105GFG and TCD1106GFG, which are compact 1500-pixel monochrome CCD linear image sensors for industrial equipment…
2020.06.12 by 강정규 기자