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"Strengthening the security of battlefield equipment starts with selecting a vehicle MCU"
As technologies such as ADAS, IVI, ECU, V2X, and autonomous driving continue to advance, the proportion of electrical and electronic components in aut…
2020.06.04 by 이수민 기자
Semiconductor equipment sales in the first quarter of this year increased by 13% compared to Q1 2019.
Global semiconductor equipment sales in the first quarter of 2020 reached $15.57 billion, representing a 13% increase compared to the same period last…
2020.06.03 by 강정규 기자
ST Unveils Driver Evaluation Board for High-Power LED Lighting
ST has launched the EVL150W-HVSL LED driver evaluation board and reference design to accelerate the development of LED street lights and medium to hig…
2020.06.03 by 이수민 기자
ADI Launches New Power Transceiver with Integrated DC/DC Converter
Analog Devices has introduced the ADM2867E power transceiver, which integrates an iCoupler isolated RS485 and an isolated DC/DC converter. The ADM2867…
2020.06.03 by 이수민 기자
Samsung Electronics, 'Memory Super-gap', Expands NAND Flash Production Lines
Samsung Electronics announced that it is proceeding with cleanroom construction for the Pyeongtaek Line 2 NAND flash facility starting in May, with pl…
2020.06.01 by 이수민 기자
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Toshiba Launches New 600V Compact IPD with Reduced Power Loss
Toshiba has launched the high-voltage intelligent power device (IPD) 'TPD4162F'. Designed to drive motors in products such as air conditioners, air pu…
2020.05.29 by 강정규 기자
Infineon Launches Drive Option Modular Evaluation Platform
Infineon Technologies announced the launch of a modular evaluation board platform that enables easy testing of various drive options for 1200V CoolSiC…
2020.05.29 by 강정규 기자
"Electronic device form factors are becoming more diverse." IBS succeeds in synthesizing large-area single-crystal metal thin films.
The Institute for Basic Science has succeeded in diversifying the surface patterns of metal substrates for synthesizing high-performance two-dimension…
2020.05.28 by 이수민 기자
Mouser Supplies NXP NFC NTAG-Supported Bluetooth LE SoC
Mouser Electronics announced that it supplies NXP Semiconductor's QN9090 and QN9030 SoCs. The two intelligent connectivity solutions support Bluetooth…
2020.05.28 by 강정규 기자
ST Strengthens ToF Sensor Capabilities with Launch of VL53L3CX
ST Microelectronics announced that it has expanded its FlightSense ToF distance measurement sensor capabilities with the launch of the VL53L3CX. The V…
2020.05.28 by 명세환 기자
Microchip Launches 4th Generation PCIe Switch 'Switchtec' Family
Microchip has launched the SwitchTec PAX Advanced Fabric fourth-generation PCIe switch product family to support cloud, data center, and hyperscale co…
2020.05.28 by 이수민 기자
Rohm Group's LAPIS Develops Automotive Speech Synthesis LSI, Capable of Updating Voice Data Even After Shipment
Rohm Group Lapis Semiconductor has developed the ML2253x series, a vehicle-grade voice synthesis LSI suitable for audio output systems in ADAS and AVA…
2020.05.27 by 이수민 기자
LG Electronics Launches Two 65-Inch 8K NanoCell TVs in Korea
LG Electronics has launched a new nanocell TV product in the domestic market that implements 8K resolution on a 65-inch display. Nanocell is a technol…
2020.05.27 by 강정규 기자
Arm Unveils New CPUs, GPUs, and NPUs with Enhanced Machine Learning
Arm announced four next-generation mobile solutions. The Cortex-A78 CPU offers 20% improved sustained performance per watt compared to the A77, and th…
2020.05.27 by 이수민 기자
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Samsung Electronics to Mass Produce EAL 6+ Security Chips for Smart Devices
Samsung Electronics has unveiled the S3FV9RR, a security chip for smart devices. This product, which incorporates security software developed in-house…
2020.05.26 by 이수민 기자