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Nordic Launches nRF52820 SoC with Bluetooth 5.2
The Nordic nRF52820 is a low-end wireless connectivity solution supporting Bluetooth LE, Bluetooth Mesh, Thread, Zigbee, and proprietary 2.4GHz. It su…
2020.03.19 by 이수민 기자
Intel Unveils 'Pohoiki Springs' Providing 100 Million Neuron Computations
Intel has unveiled the status of Pohoiki Springs, its latest neuromorphic research system that delivers 100 million neuron operations. Pohoiki Springs…
2020.03.19 by 최인영 기자
Release of Encryption-Supported MCU Blocking Rootkit and Bootkit Malware
Microchip Technology has unveiled the CEC1712, a cryptography-enabled MCU model that can block malicious malware such as rootkits and bootkits for sys…
2020.03.19 by 최인영 기자
Power Integrations' SCALE-iDriver for SiC MOSFETs Achieves AEC-Q100 Automotive Qualification
Power Integrations' (POWI) high-efficiency single-channel gate driver SIC118xKQ SCALE iDriver for silicon carbide (SiC) MOSFETs has achieved AEC-Q100 …
2020.03.18 by 최인영 기자
Samsung Electronics Strengthens Foundry and Expands Overseas 5G Business
Samsung Electronics held its 51st regular shareholders' meeting and announced its management performance for the previous year. On a consolidated basi…
2020.03.18 by 이수민 기자
Onsemi and GTAT Join Forces to Produce and Supply SiC Materials
ON Semiconductor has signed a contract worth approximately $50 million with GTAT, targeting silicon carbide material production and supply over the ne…
2020.03.18 by 최인영 기자
Can 256GB of ultra-large data processing in the AI era become a reality with FPGA accelerators?
Recent strength in the mobile market has led to an expansion in investment scale for data center servers. As technology enabling multiple users to sim…
2020.03.17 by 최인영 기자
ROHM's 'SiC Power Device' Installed in OBC for Chinese Electric Vehicles
Rohm's SiC MOSFET has been adopted in the on-board charger (OBC) for electric vehicles by UAES, a comprehensive automotive equipment Tier 1 supplier i…
2020.03.17 by 최인영 기자
Samsung Electronics Mass-produces eUFS 3.1, Twice as Fast as SATA SSD
Samsung Electronics has announced mass production of 512GB eUFS 3.1 for smartphone memory. The 512GB eUFS 3.1, which significantly expands sequential …
2020.03.17 by 이수민 기자
Launch of IEEE 802.3bt compliant PoE product family supporting 5G small cells
Silicon Labs has unveiled a product lineup that reduces the complexity arising from adding 90W Power over Ethernet (PoE) to Power Sourcing Equipment (…
2020.03.17 by 최인영 기자
Microchip Unveils SiC Power Module Family for Reduced Size and Weight
Microchip Technology has announced a portfolio of SBD-based 700V, 1200V, and 1700V variant power modules in response to surging demand for SiC-based s…
2020.03.17 by 최인영 기자
ST Launches 6-Axis Inertial Measurement Unit with 'Machine Learning Core'
ST has launched the industrial ISM330DHCX and consumer LSM6DSRX 6-axis iNEMO inertial measurement units (IMUs). ST stated that it is extending the ben…
2020.03.17 by 이수민 기자
2021 Budget Announcement for Small Business and Big 3 Sectors, Focusing Investment on Semiconductors and New Materials
The Ministry of Science and ICT deliberated and approved five agendas, including the government's research and development investment direction for th…
2020.03.17 by 최인영 기자
Infineon Launches 600V CoolMOS S7, Best-in-Class Value
Infineon has launched the 600V CoolMOS S7 product, which features optimized conduction performance, improved thermal resistance, and high pulse curren…
2020.03.16 by 최인영 기자
Sundance Launches ROS-Enabled Platform Based on Xilinx SoCs
Sundance Multiprocessor Technology, a Xilinx Alliance Partner, has launched the VCS-1 platform. The VCS-1 is a commercial product solution based on a …
2020.03.16 by 이수민 기자