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Qorvo will drive innovation in industry and mobility with UWB technology.
Qorvo, a global leader in RF and power technology, announced on the 22nd at a press briefing held at its Seoul office that it is actively driving inno…
2025.10.23 by 배종인 기자
Calterra Recognized for World's First UWB SoC Technology
Calterah, a global leader in automotive millimeter-wave (mmWave) radar and ultra-wideband (UWB) chip technologies, has been selected as an award-winni…
2025.10.22 by 배종인 기자
Microchip, Smart Connectivity Optimization
Microchip Technology, a global leader in microcontroller and analog semiconductor fields (Korea Representative: Han Byung-don), has launched the 'PIC3…
2025.10.22 by 명세환 기자
Microchip Accelerates Transition to Open Automotive Connectivity Standards
Microchip Technology has successfully demonstrated interoperability between its chipset and AVIVA Links and ASA Motion Link (ASA-ML) based chipsets.
2025.10.21 by 명세환 기자
Infineon Transforms Efficiency and Maintenance with 800V AI Data Center Power Architecture
Infineon Technologies (Korea Representative Lee Seung-soo) has unveiled an 800V direct current (VDC) power architecture for next-generation AI data ce…
2025.10.21 by 명세환 기자
Arm Leads Open AI Data Center Standards, Joins OCP Board, Accelerates Chiplet Design and Integration
"ARM is simultaneously promoting standardization of chiplet system architecture specifications and ecosystem expansion through an open chiplet ecosyst…
2025.10.21 by 명세환 기자
[Serial Project] Physical AI: Redefining the Future of Industry ①, "The Success of Physical AI Depends on the Design of Interactions Between Humans and Intelligent Machines."
While conventional AI has focused on inference and generation within digital data, Physical AI acts and responds directly in the real world through se…
2025.10.20 by 배종인 기자
ST begins mass production of in-vehicle sensing systems.
Global semiconductor company STMicroelectronics (ST) and Tobii, the global leader in eye tracking technology, have begun mass production of advanced i…
2025.10.20 by 배종인 기자
[2025 e4ds Tech Day] "The Era of Physical AI: New Opportunities for the Semiconductor Industry"
"Physical AI and on-device AI have now become essential technologies rather than optional ones, and semiconductor development for these will determine…
2025.10.20 by 배종인 기자
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[2025 e4ds Tech Day] "MCU-Based On-Device AI, Realized with 'TinyML' and Generative Platforms"
On-device AI development in MCU environments through 'TinyML,' an ultra-compact machine learning technology that enables AI models to run with memory …
2025.10.20 by 명세환 기자
[2025 e4ds Tech Day] “Lightweight Technology is Key to the On-Device AI Era”
"Lightweighting is not simply about making models smaller. To run AI in real-time on low-power devices, complex technologies are required to reduce co…
2025.10.20 by 명세환 기자
[2025 e4ds Tech Day] "Using MCUs to Power AI in Low-Power Environments Expands Possible Application Development"
"Being able to run AI models with power consumption at the several milliwatt level enables the most practical approach to developing applications real…
2025.10.20 by 배종인 기자
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[2025 e4ds Tech Day] "AI: A People- and Hardware-Centric Transformation"
"AI is evolving from data-centric to human-centric approaches, and from software-centric to hardware-centric paradigms. When technologies such as neur…
2025.10.20 by 명세환 기자
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ROHM Simultaneously Solves Motor Driver IC Heat Generation and EMI Issues
Electronic components specialist ROHM has newly launched 'BD67871MWV-Z', a three-phase Brushless DC motor driver IC for mid-voltage systems (12–48V) t…
2025.10.20 by 배종인 기자
Arm and Meta Build a Full-Stack Collaboration System to Lead the AI Era
Arm has strengthened its strategic partnership with Meta to expand AI efficiency across all computing domains, from AI software to data center infrast…
2025.10.17 by 배종인 기자