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On Semiconductor, Unveils 2 USB-C PD 3.0 Controllers
As adoption of USB-C PD increases, On Semiconductor has unveiled 2 components compliant with the PD 3.0 standard. The adaptive charging controller FAN…
2020.02.27 by 이수민 기자
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Arm chip shipments surpass 6.4 billion units in Q4 2019 alone
Arm announced in the fourth quarter of 2019 that its partners' shipments of Arm-based chips surpassed 6.4 billion units. The 6.4 billion unit shipment…
2020.02.27 by 이수민 기자
KLA Launches Two IC Micro-process Measurement Systems
KLA has launched the Archer 750 overlay metrology system and SpectraShape 11k CD and dimensional shape metrology system. The Archer 750 overlay metrol…
2020.02.27 by 이수민 기자
South Korea's IoT Sales Surpass 10 Trillion Won for the First Time in History in 2019
IoT sales exceeded 10 trillion won for the first time in 2019. The Ministry of Science and ICT announced the results of the 2019 Internet of Things In…
2020.02.26 by 이수민 기자
ST Launches STWLC68 Low-Power Integrated Wireless Charging IC
ST Microelectronics has developed an integrated wireless charging IC that can operate in high-power receivers and transmitters and enables fast power …
2020.02.26 by 최인영 기자
Samsung Electronics equips Galaxy S20 with 2mm digital personal safe
Recent increases in personal authentication, financial transactions, and cloud service usage through mobile devices have made protection of sensitive …
2020.02.26 by 이수민 기자
ST Launches BLDC Driver for High-Voltage Applications
ST has added four new products to its motor control SiP product line STSPIN32F0, which simplifies the design of industrial equipment and home applianc…
2020.02.26 by 이수민 기자
Samsung Electronics begins mass production of industry-first 16GB mobile DRAM.
Samsung Electronics has begun mass production of 16GB LPDDR5 mobile DRAM. The 16GB mobile DRAM package is equipped with eight 12Gb (=1.5GB) chips and …
2020.02.25 by 이수민 기자
Keysight-Samsung Electronics Strengthen Cooperation in 5G DSS Technology Verification
Keysight announced an expansion of its collaboration with Samsung Electronics' System LSI division for validating Dynamic Spectrum Sharing (DSS) techn…
2020.02.25 by 이수민 기자
TI Launches 36V, 4A DC/DC Buck Module with Increased Thermal Resistance
Texas Instruments has released the TPSM53604 DC/DC buck module. The TPSM53604 is a power module with a 5mm × 5.5mm footprint adopting a QFN package, r…
2020.02.25 by 이수민 기자
Intel Introduces Portfolio to Accelerate 5G Network Deployment
By 2024, 5G base stations are expected to reach 6 million units, and as a result, more than 80% of the core network is projected to be virtualized. In…
2020.02.25 by 이수민 기자
Infineon Launches Motor Control IC 'iMOTION IMC300'
Infineon's IMC300 combines the iMOTION MCE with an MCU based on the Arm Cortex-M0 core, making it suitable for variable speed drives requiring high ap…
2020.02.24 by 이수민 기자
Samsung Electronics Supplies 5G Equipment to US Cellular, the 5th Largest US Mobile Carrier
Samsung Electronics has concluded a contract to supply 5G and 4G mobile communication equipment with US Cellular, a U.S. mobile carrier. This marks th…
2020.02.24 by 이수민 기자
Mouser Launches PAC5556, Bringing Intelligent Power Control to Smart Appliances
Mouser and Korbo have added the PAC5556 Power Application Controller to their supply chain, which provides intelligent power control functionality wit…
2020.02.21 by 최인영 기자
Teledyne DALSA Launches Machine Vision Camera with Enhanced Detection Capabilities through Real-time Image Upconversion
Teledyne DALSA has launched the Linea HS 32k TDI camera, a charge domain CMOS TDI camera utilizing pixel offset technology. The Linea HS 32k employs t…
2020.02.21 by 이수민 기자