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Xilinx Samples 16GB HBM-integrated FPGA
When processing large-scale massive data sets, bandwidth affects processing speed at every stage. For data-intensive workloads such as security proces…
2019.09.24 by 이수민 기자
Silicon Labs Launches AEC-Q100 Compliant Timing Solutions
As automotive systems become increasingly complex, clocking requirements in automotive applications are also becoming more demanding. In response, Sil…
2019.09.24 by 이수민 기자
ST Unveils its First 8-Pin STM32 MCU Series, the STM32G0
ST Microelectronics supplies STM32 MCUs in an 8-pin package. The new four types of STM32G0 devices are based on an 8-pin package and feature a 64MHz A…
2019.09.24 by 최인영 기자
The automotive semiconductor market is rapidly growing in the era of autonomous driving.
The number of semiconductors used in a single automobile was approximately 300 units in 2010, but it is projected that approximately 2,000 semiconduct…
2019.09.23 by 이수민 기자
Power Integrations Unveils Two 200V Diodes for Automotive Audio with AEC-Q101 Certification
Power Integrations' LQ10N200CQ and LQ20N200CQ, which are 200V Qspeed diodes for automotive audio system applications, have obtained AEC-Q101 automotiv…
2019.09.23 by 이수민 기자
ST supplies SiC power devices to Renault-Nissan-Mitsubishi
ST Microelectronics' SiC power electronics devices have been adopted in the on-board charger (OBC) of electric vehicles set to be launched by Renault-…
2019.09.20 by 이수민 기자
Samsung Electronics Launches 19 "Unstoppable" PCIe Gen4 SSDs
Samsung Electronics has launched 19 models of PCIe Gen4 SSDs equipped with FIP, SSD virtualization, and V-NAND machine learning technologies. Based on…
2019.09.20 by 이수민 기자
TI Unveils LDO Linear Regulators That Extend Battery Life
As demand for smaller and smarter connected devices increases, attention to battery life is also growing. To maintain extended battery life, ultra-low…
2019.09.19 by 최인영 기자
ROHM Launches SiC MOSFET in TO-247-4L Package
Rohm has launched six types of 650/1200V SiC MOSFETs with trench gate structure (SCT3xxx xR series) suitable for high-efficiency server power supplies…
2019.09.19 by 이수민 기자
ADI Unveils Dual-Drive Capability Output Driver for IIoT Applications, Boosting Power Efficiency and Reducing Electromagnetic Emissions
Analog Devices has unveiled the ADuM4122, an isolated dual-channel gate driver based on its iCoupler technology. The ADuM4122 enables designers to lev…
2019.09.19 by 최인영 기자
ON Semiconductor Unveils Square 300,000-Pixel Image Sensor
onsemi has unveiled the ARX3A0 digital image sensor, which delivers a resolution of 300,000 pixels in a 1:1 aspect ratio. The ARX3A0 operates like a g…
2019.09.19 by 이수민 기자
ST strengthens its focus on the industrial high-performance embedded processor market
STMicroelectronics has announced that it is strengthening its strategy to capture the industrial embedded processor market based on the STM32. ST's ST…
2019.09.18 by 이수민 기자
Semiconductor Thin Film Deposition Process Now Observed in Real Time
Thin films play a role in isolating and connecting semiconductor circuits, as well as protecting them. Therefore, semiconductor quality improves as th…
2019.09.18 by 이수민 기자
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AI wind blowing in the financial world, what can FPGA do?
As fintech becomes mainstream, the financial industry has faced the challenge of efficiently processing explosively increasing data. The financial sec…
2019.09.17 by 이수민 기자
Investment in fab construction reaches $50 billion in 2020
According to SEMI's latest global fab outlook report, investment in newly constructed fabs starting in 2020 is projected to reach $50 billion, an incr…
2019.09.16 by 이수민 기자