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Xilinx Announces FPGA with 9 Million System Logic Cells
Xilinx has launched the Virtex UltraScale+ VU19P FPGA, which integrates 9 million system logic cells. The VU19P, featuring 35 billion transistors, del…
2019.08.22 by 이수민 기자
Nordic Launches Easy Cellular IoT Prototyping Platform
Nordic Semiconductor has launched Thingy:91, a cellular IoT prototyping platform. This platform provides certification for LTE-M/NB-IoT applications a…
2019.08.22 by 최인영 기자
Mouser to Supply TI's Half-Bridge MOSFET and GaN FET Driver 'LMG1210'
Mouser supplies TI's LMG1210 200V half-bridge MOSFET and GaN FET driver. The LMG1210, part of TI's GaN power portfolio, offers advantages including hi…
2019.08.20 by 이수민 기자
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Samsung Electronics Launches 108-Megapixel Mobile Image Sensor
Samsung Electronics has unveiled the ISOCELL Bright HMX, a mobile image sensor with 108 megapixels that breaks through the 100-megapixel barrier. The …
2019.08.19 by 이수민 기자
Spearhead of DRAM Speed Innovation, HBM2E Launched: "50% Faster than HBM2"
SK Hynix has successfully developed HBM2E DRAM. HBM2E is the next-generation product of HBM DRAM, which offers higher data processing speeds compared …
2019.08.19 by 이수민 기자
Mouser is working on "Big Ideas and Engineering" for small and medium-sized makers.
Mouser, together with Grand Imaara, is launching a new series titled "Big Ideas and Engineering" with the theme of "Innovation Through Collaboration."…
2019.08.16 by 명세환 기자
Nuvoton Launches MS51 Series Small Form Factor Industrial MCUs
Taiwan semiconductor company Nuvoton Technology has released the MS51 series MCU that meets industrial standards. The product offers 8/16/32KB Flash a…
2019.08.16 by 명세환 기자
[Contribution] Bluetooth® Low Energy PEPS System with CAN Nodes
The implementation of next-generation PEPS systems in vehicles has become possible through Bluetooth Low Energy technology. As developers address the …
2019.08.13 by 명세환 기자
Lam Research Announces Additional Global Wafer Stress Management Solutions for 3D NAND Scaling
Semiconductor equipment maker Lam Research unveiled a global wafer stress management solution in its 3D NAND scaling portfolio.
2019.08.13 by 명세환 기자
Xilinx Acquires Solarflare to Provide Integrated Platform Solutions
Xilinx changes data center market competition landscape with Solarflare acquisition. Through Solarflare's SmartNIC network interface card technology, …
2019.08.13 by 명세환 기자
Samsung Electronics begins mass production of SSDs and DRAM modules for next-generation servers.
Samsung Electronics has begun mass production of the PM1733 high-performance NVMe SSD lineup based on the PCIe 4.0 interface and high-capacity DRAM mo…
2019.08.10 by 이수민 기자
Mouser now stocks ADI's LTM7400 regulator, easing data center cooling requirements.
Mouser Electronics supplies ADI's LTM4700 µModule regulator. The LTM4700 step-down switching mode regulator combines high power characteristics with e…
2019.08.10 by 이수민 기자
Microchip Enters Memory Infrastructure Market with SMC Launch
As the number of processing cores within CPUs increases, the average memory bandwidth available to each processing core has decreased. This is because…
2019.08.09 by 이수민 기자
Designing security for IoT devices easily with STM32Trust
STMicroelectronics launched STM32Trust on the 8th, enabling designers to easily implement powerful cyber protection features in new IoT devices by lev…
2019.08.09 by 이수민 기자
Next-generation Intel Xeon 'Cooper Lake' processor with up to 56 cores to be released in the first half of next year
Intel announced the Xeon Scalable processor family, the Cooperlake processor. The Cooperlake processor provides up to 56 cores per socket on standard …
2019.08.08 by 이수민 기자