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AMD Launches the Ryzen™ Embedded 9000 Series, Setting a New Standard for Industrial Computing
As industrial computing and automation technology evolve rapidly, AMD has announced the next-generation Ryzen™ Embedded 9000 Series, a new embedded pr…
2025.10.14 by 명세환 기자
Imec Launches 300mm GaN Program
Imec, a world-leading nanoelectronics and digital technology research institute, is embarking on a full-scale initiative to develop advanced power ele…
2025.10.13 by 배종인 기자
Senstone, Global IoT/OT Security Innovation Internationally Recognized
Senseton, an authentication security specialist, was selected as the sole winner of "Comprehensive IoT Security Solution of the Year" at the Cyber Sec…
2025.10.13 by 명세환 기자
Silicon Labs Achieves PSA Level 4 Security Certification, Setting a New Standard for IoT Security
Silicon Labs has officially announced the SiMG301 and SiBG301 Series 3 SoC platform for the next generation of wireless connectivity. The SiMG301 is a…
2025.10.13 by 배종인 기자
[Technical Contribution] ADI: "Multiphase Flyback Converter Delivers Over 60W of Power"
Frederik Dostal, a power management expert at Analog Devices, Inc., discusses the design of flyback converters for high-power applications.
2025.10.13 by 명세환 기자
Intel Unveils 18A Process Panther Lake and Xeon 6+, Entering the 2nm Era
Intel has unveiled its next-generation client and server processors, 'Panther Lake' and 'Xeon 6+', based on the 18A process node. Panther Lake is Inte…
2025.10.13 by 명세환 기자
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Samsung and OpenAI Begin Collaborating on Global AI Infrastructure
Samsung has signed a Letter of Intent (LOI) with OpenAI, a leading global AI company, to build global AI core infrastructure, and is moving forward wi…
2025.10.02 by 배종인 기자
L&F and LS complete construction of Saemangeum precursor plant, strengthening the K-battery value chain.
L&F, a global secondary battery materials specialist, and LLBS, a joint venture between L&F and LS Group, have completed construction of a precursor p…
2025.10.02 by 명세환 기자
SK and OpenAI partner to innovate across the entire technology cycle, from chip development to data center operations.
SK Chairman Chey Tae-won and OpenAI CEO Sam Altman sign a Letter of Intent (LOI) for memory supply and a Memorandum of Understanding (MOU) for establi…
2025.10.02 by 명세환 기자
Applied Materials and GlobalFoundries Partner to Develop AI-Based Photonics
Applied Materials has entered into a strategic partnership with GlobalFoundries and will establish a state-of-the-art waveguide manufacturing facility…
2025.10.02 by 명세환 기자
TI Strengthens High-Precision Digital Lithography Technology for Advanced Packaging
Texas Instruments (TI) has launched the DLP991UUV, a new digital micromirror device (DMD) for next-generation digital lithography technology, strength…
2025.10.02 by 명세환 기자
ST Strengthens Vehicle Electrical System Stability
STMicroelectronics (hereinafter ST), a global semiconductor company supporting diverse electronic applications and customers, has launched a new linea…
2025.10.01 by 배종인 기자
ROHM Mass-Produces Compact, Thin, High-Voltage TOLL Package SiC MOSFETs
Rohm has begun mass production of its TOLL package SiC MOSFET "SCT40xxDLL" series, which simultaneously realizes miniaturization and high-power capabi…
2025.10.01 by 명세환 기자
Imec Appoints Patrick Vandenameiler as Next CEO, Beginning Strategic Leadership Transition
Global nanoelectronics and digital technology research institute Imec officially appoints Patrick Vandenameele as its next Chief Executive Officer (CE…
2025.09.30 by 명세환 기자
[2025 e4ds Tech Day] "Although a latecomer to GaN semiconductors, we are rapidly advancing by overcoming technological limitations."
Lee Hyung-seok, Senior Researcher at the Electronics and Telecommunications Research Institute (ETRI), presented "Development Status and Market Trends…
2025.09.30 by 배종인 기자