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TI Launches Automotive System-Based Chip with Integrated CAN FD Controller and Transceiver
Texas Instruments announced the launch of an automotive system-based chip product that integrates a CAN FD controller and transceiver. The TCAN4550-Q1…
2019.06.14 by 이수민 기자
Characteristics and prospects of the three next-generation memories that have entered the commercialization stage: MRAM, PCRAM, and ReRAM
Three new memory technologies—MRAM, PCRAM, and ReRAM—are entering the commercialization phase after decades of research, presenting significant opport…
2019.06.13 by 이수민 기자
Semiconductors are the key to implementing connected smart factories.
As the use of automated and autonomous systems increases, factories are becoming less dependent on labor forces to handle repetitive and complex manua…
2019.06.12 by 이수민 기자
Samsung Electronics Presents 8K Roadmap at 8K Display Summit
Samsung Electronics held an 8K Display Summit in Manhattan, New York, and moved forward with establishing 8K as the mainstream trend. At this event, S…
2019.06.12 by 이수민 기자
Global fab equipment investment will decline this year but increase next year.
According to SEMI's latest Global Fab Outlook report, global fab equipment investments in 2019 are expected to decline 19% year-over-year to $48.4 bil…
2019.06.12 by 이수민 기자
ADI Launches Multi-Channel Mixed-Signal RF Converter Platform
Analog Devices has launched its MxFE RF data converter platform that integrates high-performance analog and digital signal processing capabilities for…
2019.06.11 by 이수민 기자
Potential to dramatically increase the speed and capacity of next-generation memory semiconductor MRAM discovered
Professor Jung Myung-hwa's research team at Sogang University has demonstrated the potential to further advance the speed and storage capacity of magn…
2019.06.10 by 이수민 기자
Infineon Launches CoolSiC Schottky 1200V G5 Diodes
Infineon Technologies has launched the CoolSiC Schottky 1200V G5 diode available in a TO247-2 package. The new product achieves higher efficiency by r…
2019.06.10 by 이수민 기자
AI device operating at the speed of light has been developed
A research team led by Professor Park Nam-gyoo, Dr. Yu Seon-gyoo, and Dr. Park Hyun-hee at Seoul National University has successfully demonstrated the…
2019.06.08 by 이수민 기자
Mouser now stocks Maxim's MAX77860 switch-mode step-down charger for portable applications.
Mouser Electronics supplies Maxim's MAX77860 switch mode buck charger. Combining high performance, wide input voltage range, and USB Type-C CC detecti…
2019.06.07 by 이수민 기자
Teledyne LeCroy Unveils High-Speed Interconnect Analyzer
Teledyne LeCroy has unveiled the WavePulser 40iX, a high-speed interconnect analyzer that provides solutions for interconnect testing and validation. …
2019.06.06 by 이수민 기자
ADI Launches mmWave 5G Network Infrastructure Support Solution
Analog Devices has launched a solution for mmWave 5G wireless network infrastructure. Achieving a high level of integration to alleviate the design re…
2019.06.04 by 이수민 기자
Tektronix Strengthens Next-Generation Midrange Oscilloscope Portfolio with the Launch of the 3 Series MDO and 4 Series MSO
Tektronix has launched the 3 Series MDO and 4 Series MSO, next-generation mid-range oscilloscopes. The new products incorporate the user interface tha…
2019.06.04 by 이수민 기자
Samsung Electronics to Use AMD's Ultra-Low-Power Graphics IP
Samsung Electronics has entered into a strategic partnership with AMD regarding ultra-low-power and high-performance graphics intellectual property (I…
2019.06.04 by 이수민 기자
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Reducing Hidden Costs When Designing Next-Generation Insulation Solutions
Electronic device systems are becoming increasingly compact and lightweight. The need for isolation between various electronic devices and systems is …
2019.06.04 by 이수민 기자