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Samsung Electronics to Mass-Produce 256GB UFS Internal Memory for Smartphones
Samsung Electronics will begin mass producing the industry's first 256-gigabyte UFS (Universal Flash Storage) embedded memory for next-generation smar…
2016.02.25
Linear Introduces 2kVAC Isolated μModule Converter
Linear Technology announced the launch of DC/DC μModule® regulators (model numbers: LTM8067/LTM8068) that provide 2kVAC galvanic isolation. The LTM806…
2016.02.25 by 명세환 기자
Lattice Semiconductor Expands Connectivity and Acceleration Products
Lattice Semiconductor, a leading provider of customized smart connectivity solutions, has announced an expansion of its ECP5™ connectivity and acceler…
2016.02.25
ON Semiconductor Launches 13M Pixel CMOS Image Sensor
ON Semiconductor has expanded its imaging solution portfolio with the launch of its latest high-performance CMOS digital image sensor. The newly relea…
2016.02.25 by 명세환 기자
Tektronix Announces Ultra-Compact Standalone DC E-LOAD Product Line
Tektronix recently announced the Keysight Series 2380 product line, an ultra-compact standalone DC electronic load device that complements its complet…
2016.02.24 by 명세환 기자
NXP Announces Smallest Ultra-Low Power 64-Bit ARM-Based Processor
NXP Semiconductor has introduced the QorIQ LS1012A processor, which delivers enterprise-grade performance and security features for consumer and netwo…
2016.02.24 by 명세환 기자
Microchip Launches Product Family Combining I/O Functionality and Hardware Monitoring
Microchip Technology, a global leader in microcontrollers, analog semiconductors, and flash-IP solutions, has launched the new SCH322X product family,…
2016.02.24
Silicon Labs simplifies Wi-Fi connectivity with plug-and-play module
Silicon Labs announced the launch of a plug-and-play Wi-Fi module solution (product name: WGM110) suitable for IoT (Internet of Things) applications. …
2016.02.24 by 명세환 기자
ST, 6-axis MEMS sensor module that turns smartphones into personal assistants
ST has newly launched the LSM6DSL and LSM6DSM, ultra-compact 6-axis MEMS inertial modules designed for ultra-low power consumption. These new products…
2016.02.24 by 명세환 기자
ADI, the era of wearables for material composition analysis devices has arrived.
Dror Sharon, co-founder and CEO of Consumer Physics, stated, "We are pleased that through our collaboration with ADI, we can now integrate SCiO techno…
2016.02.24
NXP Supports Mobile Payments on Snapdragon-Based Smartphones
NXP Semiconductor announced that it has combined industry-leading near-field communication (NFC) and embedded secure element (eSE) solutions with Qual…
2016.02.23
ST Demonstrates End-to-End Security Architecture for Wearable Fingerprint Authentication
Gemalto, Fingerprint Cards (hereinafter FPC), Precise Biometrics (hereinafter PB), and STMicroelectronics (hereinafter ST) will present for the first …
2016.02.23
NXP Announces Strategic Initiative for Rapid 5G Implementation
NXP Semiconductor has announced a strategic plan comprised of products and technologies that address all system requirements for 5G. NXP is combining …
2016.02.23 by 명세환 기자
Linear Launches 18-Bit, 8-Channel Multiplex Input SAR ADC
Linear Technology Korea announced the launch of the LTC2335-18, an 18-bit, 8-channel 1Msps multiplexed input SAR (successive approximation register) A…
2016.02.23 by 명세환 기자
ON Semiconductor Expands Optical Image Stabilization Portfolio Ensuring Photo Quality
ON Semiconductor has added the LC898123AXD, a next-generation optical image stabilization (OIS)/autofocus (AF) driver, to its portfolio. This enables …
2016.02.22 by 명세환 기자