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SanDisk Unveils New Industrial Memory Card Products
SanDisk announced new industrial memory cards, the SANDISK® IX QD352 microSD™ and IX LD352 SD, at 'Embedded World 2026' held in Nuremberg, Germany on …
2026.03.12 by 배종인 기자
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Lenovo Unveils AI-Powered Gaming Tablet, the LegionTab Y700 5th Gen
Lenovo Korea announced the domestic launch of the Legion Tab Y700 5th Generation, a gaming-specialized tablet, on March 12th. The new product is equip…
2026.03.12 by 명세환 기자
Keysight Unveils AI-Based Electronic Design Assistant
Keysight Technologies has introduced AI-based 'Chat' and 'Copilot' assistant features in its ADS (Advanced Design System) software. This functionality…
2026.03.12 by 배종인 기자
Hanwha Systems is gearing up to secure future defense and ICT talent.
Hanwha Systems will recruit talent on a three-digit scale in the defense and ICT sectors through regular new employee hiring in the first half of 2026…
2026.03.12 by 명세환 기자
NXP Launches CoreRide Z248, Optimized for 48V Zone Architecture
NXP Semiconductor unveiled CoreRide Z248, a new zone-based system for automotive manufacturers, on March 12th. This system integrates 48V power distri…
2026.03.12 by 배종인 기자
[Deep Dive] MCU Sheds Its "Control" Shell and Embraces "Intelligence": A Major Transition to an Edge AI Platform
Today, the biggest topic facing embedded systems designers is undoubtedly 'AI'. However, many edge devices surrounding us—refrigerators, door locks, i…
2026.03.12 by 명세환 기자
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NVIDIA Defines AI as a "Five-Layer Cake" and Releases a Blueprint for Next-Generation AI Infrastructure Transformation
Nvidia has defined AI as core infrastructure comprising a "5-tier cake" structure composed of energy, chips, infrastructure, models, and applications.…
2026.03.11 by 배종인 기자
MPS, “‘MPM3695 Family’ Meets High-Current, Low-Voltage Power Supply Design Demands”
MPS Technical Support Director Jung Tae-hoon discusses integrated power modules for high-current power design, a new approach to flexible output volta…
2026.03.11 by 편집부
Silicon Labs and Banff are transforming the automotive "analog domain" into a digital one with intelligent tire technology.
Low-power wireless semiconductor company Silicon Labs and domestic intelligent tire system specialist BANF have unveiled next-generation automotive ti…
2026.03.11 by 배종인 기자
congatec Expands its Intel Core Series 2-Based COM-HPC Modules
As real-time control and parallel data processing demands grow in industrial environments, the role of high-performance edge computing modules is expa…
2026.03.11 by 명세환 기자
TI Usheres in the Era of "Edge AI for Every Device" with TinyEngine™ NPU-Integrated MCUs
Texas Instruments (TI) held an online press briefing on the 11th, introducing the TinyEngine™ NPU-integrated MCU to be showcased at Embedded World 202…
2026.03.11 by 배종인 기자
Samsung Electronics Launches Galaxy S26 and Buds 4 Globally
Samsung Electronics will sequentially launch the Galaxy S26 series and Galaxy Buds4 series in approximately 120 countries, including South Korea, the …
2026.03.11 by 명세환 기자
NXP Unveils 'i.MX 93W', Integrating AI, Wireless, and Security, Targeting Edge-Based Physical AI Expansion
NXP Semiconductors has unveiled the i.MX 93W application processor, which integrates AI computing, wireless connectivity, and security functions into …
2026.03.11 by 배종인 기자
Infineon aims to achieve 23.2% MCU market share by 2025, expanding into the automotive and robotics markets.
Infineon recorded a 23.2% market share in the global microcontroller (MCU) market in 2025. This represents an increase of 1.8 percentage points from 2…
2026.03.11 by 배종인 기자
77% of companies adopting AI report increased hiring... Data is a barrier to its expansion.
Contrary to concerns that generative AI will reduce jobs, survey results show that hiring increases have been more prevalent in actual corporate setti…
2026.03.11 by 배종인 기자