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TI launches interface IC supporting up to 4K2K maximum screen resolution for tablets, notebooks and all-in-one PCs

2013.12.27 by 명세환 기자

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CSR, First Bluetooth 4.1 Standard Solution Certified

2013.12.27 by 명세환 기자

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Analog Devices' MEMS technology integrated into Withings' 'Pulse' activity monitor

2013.12.27 by 명세환 기자

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Agilent Korea Launches New EXM Wireless Test Set

2013.12.27 by 명세환 기자

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Linear, 42V, 3.5A (IOUT), 2.2MHz Synchronous Step-Down DC/DC Converter Launch

2013.12.27 by 명세환 기자

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Silicon Image Launches Industry's First MHL® 3.0 4K Ultra HD Solution for Mobile Devices

2013.12.27 by 명세환 기자

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Broadcom Announces Bluetooth Smart SoC Supporting Wireless Charging

2013.12.27 by 명세환 기자

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Freescale Announces Powerful High-Speed CAN Transceivers for Industrial and Automotive

2013.12.27 by 명세환 기자

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Silicon Labs Completes Smart Interface Portfolio with Release of USB-SPI Bridge Chip

2013.12.27 by 명세환 기자

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STMicroelectronics Launches ISO8200B Isolated Power Switch for Industrial Automation Systems

2013.12.27 by 명세환 기자

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Broadcom Launches Automotive Bluetooth Software Stack, Enabling Seamless Android Connectivity in Vehicles

2013.12.27 by 명세환 기자

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Xilinx Introduces 20nm All Programmable UltraScale Portfolio with ASIC-Class Architecture and ASIC-Strength Design Solutions

2013.12.27 by 명세환 기자

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Xilinx Achieves Industry Record with 4.4M Logic Cells, Doubling Highest Capacity Device Density One Generation Ahead

2013.12.27 by 명세환 기자

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TI Launches Industry's Most Flexible Haptic and Capacitive Touch Combo Solution to Realize 'Haptics for Everyone'

2013.12.27 by 명세환 기자

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NXP Launches Ultra-High Efficiency, Smallest CAN System-Based Chip for In-Vehicle Networks

2013.12.27 by 명세환 기자