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DeepX, On-Device AI Solution Business Collaboration Agreement
AI semiconductor company Deepx announced on the 12th that it has signed a strategic business cooperation agreement with Daewon CTS, the country's larg…
2024.04.12 by 명세환 기자
Onsemi Launches Next-Generation Electrochemical Sensor Solution
The ability to measure chemical substances from life and environmental science to industrial materials and food processing provides significant insigh…
2024.04.11 by 명세환 기자
NVIDIA Supports LocalPC Foundation Models, Improving Accessibility to Generative AI
Foundation models are AI neural networks typically trained on vast amounts of raw data through unsupervised machine learning. They are a type of artif…
2024.04.11 by 명세환 기자
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NXP Expands Edge Portfolio with MCX W Wireless MCU Series
NXP Semiconductor announced on the 11th that it is adding extensive connectivity to its MCX portfolio through the latest devices in the MCX W series, …
2024.04.11 by 명세환 기자
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Microchip Launches AVR DU USB MCU Product Family
Well-known advantages of USB (Universal Serial Bus) interfaces for embedded design include compatibility with various devices, simplified communicatio…
2024.04.11 by 명세환 기자
Ministry of Science and Technology selects winners of the Republic of Korea Engineering Award
The Ministry of Science and ICT and the Korea Industrial Technology Promotion Association announced on the 8th that they have selected Shin-hee Han, S…
2024.04.08 by 명세환 기자
ST, Panasonic Cycle Technology Support AI Introduction to Electric Assist Bicycles
STMicroelectronics (hereinafter ST) is supporting the adoption of AI in Panasonic Cycle Technology's (hereinafter Panasonic) electric-assist bicycles.
2024.04.08 by 성유창 기자
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NXP Announces Open S32 CoreRide Platform, Accelerating SDV Development Standardization
NXP Semiconductors unveiled a platform that integrates off-the-shelf software from its existing S32 computing, networking, system power management, an…
2024.04.08 by 성유창 기자
Infineon Blocks Heat Transfer in Automotive Electronic Control Units with Top-Side Cooling Package
Infineon Technologies (Korea CEO Lee Seung-soo) has launched its power MOSFET product in SSO10T TSC package with top-side cooling capability, which bl…
2024.04.05 by 배종인 기자
Zicore Opens H100 Dedicated Data Center in Incheon… “This Year’s GPU Expansion Goal: 320 → 1,000”
Gcore held a press briefing on the 4th at The Plaza Hotel Seoul City Hall and unveiled Korea's first NVIDIA H100-based AI public cloud service to the …
2024.04.05 by 김예지 기자
ETRI Helps Domestic Companies Design and Produce GaN Semiconductor Chips
The Electronics and Telecommunications Research Institute (ETRI) held a public presentation on the fourth of this month at its headquarters with the a…
2024.04.05 by 배종인 기자
IAR Supports Renesas RISC-V MCUs
IAR, a global provider of software and services for embedded development, has announced an enhanced version of its premium development environment tha…
2024.04.05 by 배종인 기자
Song Kyung-min, Infineon Director - “Increasing development and adoption of wireless communications… RF systems are important”
RF systems are used in wireless communications, radar tracking, signal processing, and various applications. With the increasing use of portable wirel…
2024.04.05 by 성유창 기자
Samsung Electronics, 2024 Q1 sales 71 trillion… 11% increase year-on-year
According to Samsung Electronics' preliminary business results for the first quarter of 2024 announced on the 5th, revenue reached 71 trillion won, an…
2024.04.05 by 배종인 기자
Infineon Bernard Berg Supports AI’s Disruptive Innovation
We have arranged an opportunity to hear from Bernard Berg of Infineon Technologies about semiconductor solutions to support AI that uses tremendous co…
2024.04.04 by 명세환 기자