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AMD Embedded+ Launch, “Background for Rapid Increase in Edge AI Chips and Sensor Data Analysis”
Growing supply of AI inference chipsets is expected at the edge. Machine vision and sensor data analytics are projected to drive edge AI-related shipm…
2024.02.06 by 명세환 기자
Onsemi's Q4 2023 sales reached KRW 2.6 trillion, with SiC sales growing fourfold.
ON Semiconductor, a leading company in intelligent power and sensing technology, announced its 2023 fiscal year annual and fourth quarter results on t…
2024.02.06 by 명세환 기자
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Cadence Announces Enterprise Multiphysics Platform… Accelerating Digital Twins
Cadence Design Systems, Inc. announced on the 5th the "Cadence Millennium Enterprise Multiphysics Platform," an industry-first HW/SW solution capable …
2024.02.06 by 김예지 기자
DeepX to Participate in MWC 2024... Proposes Operation of Large AI Alliance
DeepX, which has been focusing on developing on-device AI semiconductors, drew significant global attention at CES 2024 and subsequently declared its …
2024.02.06 by 명세환 기자
Teledyne LeCroy Accelerates PCIe® 7.0 Technology for AI Workloads
Teledyne LeCroy (Branch Manager Lee Woon-jae) is unveiling PCI Express® 7.0 signal generation, transmission, and measurement capabilities, acceleratin…
2024.02.05 by 배종인 기자
Anand Namveer, Senior Vice President, Merck-“AI Trends to Drive Semiconductor Industry Recovery in 2024”
Following the press briefing by Merck, this publication met with Anand Nambiar, Chief Commercial Officer, to discuss the outlook for the semiconductor…
2024.02.05 by 성유창 기자
Merck, “DSA to enhance EUV utilization for ultra-fine semiconductors”
Global materials company Merck held a press briefing at the Shilla Stay in Samsung-dong, Seoul, with the semiconductor business president from its Ger…
2024.02.05 by 배종인 기자
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Infineon and Honda Join Forces for Automotive Semiconductor Development
Infineon Technologies (Korea CEO Lee Seung-su) has signed a Memorandum of Understanding (MoU) with Honda Motor to establish strategic cooperation.
2024.02.02 by 배종인 기자
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Infineon Launches Hybrid ToF Solution for Next-Generation Smart Robots
Infineon Technologies (hereinafter Infineon) has unveiled a new hybrid Time-of-Flight (hToF) solution that significantly reduces maintenance efforts a…
2024.02.01 by 성유창 기자
EVG Announces New NanoCleave Layer Release Technology
EV Group, a leading provider of wafer bonding and lithography equipment for MEMS, nanotechnology, and semiconductor markets, has achieved thin-film 3D…
2024.02.01 by 배종인 기자
ETRI·KICET, Development of 3kV-Class Gallium Oxide Material and Device Technology
The Electronics and Telecommunications Research Institute (ETRI) and the Korea Institute of Ceramic Engineering and Technology (KICET) have jointly de…
2024.02.01 by 배종인 기자
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Merck's Anand Nambier: "Driven by data platforms, we're driving materials innovation."
Anand Nambiar, Chief Commercial Officer of Electronics Business Sector at Merck, delivered a keynote speech at Semicon Korea 2024 on the topic of "Dig…
2024.01.31 by 배종인 기자
Samsung Electronics, 2023 sales of 259 trillion won, down 14% from the previous year… semiconductor deficit of 15 trillion won
Samsung Electronics' 2023 business results saw revenue decline by 14.3% compared to 2022, affected by decreased profits due to deteriorating semicondu…
2024.01.31 by 배종인 기자
Semiconductor Supply Chain One Place, Semicon Korea 2024 Opens
SEMICON KOREA 2024, which provides a glimpse into the future of the semiconductor industry and brings together the global semiconductor supply chain i…
2024.01.31 by 배종인 기자
ADI Appoints Puccio as New CFO
Analog Devices (ADI) announced on the 30th that it will appoint Richard C. Puccio, Jr. as Executive Vice President (EVP) and Chief Financial Officer (…
2024.01.30 by 명세환 기자