ADI Launches Industrial Long-Range Ethernet PHY Solution
Many industrial process plants and buildings face the challenge of requiring service personnel to remain on-site for continuous manual involvement in …
2021.06.18 by 이수민 기자
[China Briefing] OnePlus Pushes for Merger with Oppo, etc.
e4ds News China Region ICT Briefing - June 18, 2021 [China Briefing]: ◇OnePlus, founded by former OPPO executives, recently merged ◇Taiwan in 'hot exp…
2021.06.18 by 이수민 기자
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ROHM Unveils AC/DC Converter with Integrated 1700V SiC MOSFET
Auxiliary power supplies for high-power industrial equipment have faced difficulties in achieving low power consumption due to the adoption of low bre…
2021.06.17 by 이수민 기자
ST Announces World's First G3-PLC Hybrid Certified Chipset
The G3-PLC hybrid specification enables smart grid, smart city, and industrial/IoT devices to automatically and dynamically select appropriate wireles…
2021.06.17 by 이수민 기자
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[China Briefing] Xiaomi Patents Curved Fingerprint Recognition
e4ds News China ICT Briefing - June 17, 2021 [China Brief] : ◇Xiaomi to add fingerprint unlock feature on curved screen edge ◇PSMC begins 2023 order n…
2021.06.17 by 이수민 기자
Henkel improves distribution management by introducing 'Inspian Cloud EDI'
Henkel Home Care Korea has adopted Inspien's cloud-based electronic document system, Cloud EDI, to conduct product transactions with 14 major domestic…
2021.06.17 by 이수민 기자
[China Briefing] Huawei and ZTE Capture Half of 5G Market, etc.
e4ds News China ICT Briefing - June 16, 2021 [China Briefing]: ◇Omdia announces Q1 2021 global 5G market rankings "Huawei takes first place" ◇Q1 globa…
2021.06.16 by 이수민 기자
[China Briefing] TSMC Considers Building Packaging Fab in U.S., etc.
e4ds News China ICT Briefing - June 15, 2021 [China Briefing] : ◇TSMC reviewing construction of chip packaging fab in the US ◇Huawei "HiSilicon will c…
2021.06.15 by 이수민 기자
KAIST Boosts Communication Chip Performance with Semiconductor 3D Stacking Technology
A research team led by Professor Kim Sang-hyun from the Department of Electrical and Electronic Engineering at KAIST has developed monolithic three-di…
2021.06.15 by 이수민 기자
Output current can be increased by connecting LDO regulators in parallel.
Power supply designers can connect LDO regulators in parallel to increase supply current capacity even in limited space and mitigate heat dissipation.…
2021.06.15 by 이수민 기자
[China Briefing] Qualcomm Resumes Semiconductor Supply to Huawei, Etc.
e4ds News Chinese ICT Updates - June 14, 2021 [China Briefing]: ◇Not only TSMC expressed anger over Qualcomm's resumption of Huawei supplies ◇MediaTek…
2021.06.14 by 이수민 기자
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Saenggiwon, Smart Farm Robot Commercialization Success "At 1/3 the Price"
The Korea Institute of Bioscience and Biotechnology (KIBB) has successfully developed and commercialized a robot that integrates transportation, pest …
2021.06.14 by 이수민 기자
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Arm Announces Two MCU Solutions to Boost IoT Device Compatibility
Most things in the Internet of Things (IoT) are composed of MCU-based devices. Accordingly, ensuring software compatibility for component reuse has be…
2021.06.14 by 이수민 기자
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Xilinx Announces Low-Power ACAP to Enable Edge AI
Xilinx has launched the "Versal AI Edge" series, which delivers 4x better AI performance per watt compared to GPUs and 10x higher computing density th…
2021.06.11 by 이수민 기자
[China Briefing] TSMC to Build Japanese Fab Near Sony, etc.
e4ds News China ICT Brief - June 11, 2021 [China Briefing]: ◇TSMC to Build Fab in Kumamoto, Japan "Plans to Locate Adjacent to Sony" ◇China Unicom Gan…
2021.06.11 by 이수민 기자