ADI Announces Processor Platform Providing Superior Sound in Audio Systems
Analog Devices (CEO Yang Jae-hoon) has additionally announced ADSP-SC57x and ADSP-2157x processors, which belong to the single-chip multicore SHARC® p…
2016.06.28 by 명세환 기자
Microchip Launches PIC32 Family with Core-Independent Peripherals
Microchip Technology (Korea Representative Han Byung-don) has announced the launch of its PIC32 microcontroller (MCU) product family, which offers the…
2016.06.28 by 명세환 기자
Element14 Adds NXP Low-Cost Development Platform Products
Online electronics retailer Element14 (http://kr.element14.com/) announced that it will launch NXP's low-cost development platform products on its pla…
2016.06.27 by 명세환 기자
'Wind Forum 2016' Held for Future Defense and Aviation Strategy
Wind River announced that it will hold the Wind Forum on the 30th at Lotte City Hotel in Daejeon to introduce the latest market trends and share custo…
2016.06.27 by 명세환 기자
KT to Establish Detailed 5G Technology Equipment Specifications with U.S. Verizon
KT has agreed with Verizon, North America's largest wireless carrier, to establish 5G radio access technology specifications. Based on this agreement,…
2016.06.27 by 명세환 기자
TI Helps Power Development with “Power Management Lab Kit” Series
TI (CEO Kent Chun) announced the launch of the TI Power Management Lab Kit (PMLK) series, which narrows the gap between power design theory and practi…
2016.06.27 by 명세환 기자
NI Launches 802.11ax High-Efficiency Wireless Standard Test Solution
National Instruments (ni.com/korea, hereinafter NI) has announced the NI WLAN Measurement Suite, software that supports the IEEE 802.11ax (draft 0.1) …
2016.06.27 by 명세환 기자
NXP Provides Smart City Technology Using Real-time V2X Communication Systems
NXP Semiconductor announced that it will provide advanced technologies to Columbus, Ohio, a city selected for the U.S. Department of Transportation's …
2016.06.27 by 명세환 기자
STMicroelectronics and Qualcomm Collaborate on Sensors for Smart Mobile Devices
STMicroelectronics (hereinafter referred to as ST) announced that Qualcomm Technologies Inc., a subsidiary of Qualcomm Incorporated, will provide soft…
2016.06.27 by 명세환 기자
Arasan Launches DPHY IP Core Supporting Up to 2.6Gbps
Arasan Chips Systems (www.arasan.com) has released version 1.2 of its MIPI DPHY IP core, which supports up to 2.6 Gbps on the TSMC 28nm HPC process. …
2016.06.24 by 명세환 기자
Microchip Announces Next-Generation Bluetooth Low Energy Solution
Microchip Technology (Korea Representative: Han Byung-don) has announced two next-generation Bluetooth Low Energy (BLE) solutions equipped with a simp…
2016.06.24 by 명세환 기자
3Developer Partners with 3D Scanner Manufacturer A40 at Specialized 3D Printing Exhibition
3Developer participated in the 'Inside 3D Printing Conference & Expo' held at KINTEX in Ilsan from the 22nd. At this 2016 Inside event, 3Developer co…
2016.06.24 by 명세환 기자
Toshiba Launches Low On-Resistance N-Channel MOSFETs
Toshiba Corporation's Storage & Device Solutions Company has announced the launch of a compact package N-channel MOSFET for LED driver application loa…
2016.06.24 by 명세환 기자
LG Electronics Receives Recognition for Technology Absorbing Light from Both Sides of Solar Modules
LG Electronics was recognized for its innovative technology at the world's largest solar exhibition. LG Electronics won the main prize in the Photovo…
2016.06.24 by 명세환 기자
KT Introduces Key Technologies of 'Pyeongchang 5G Standard' at the Korea Institute of Communication Sciences
KT (Chairman Hwang Chang-gyu) announced on the 23rd that it has unveiled the "PyeongChang 5G Standard" for 5G trial services at the PyeongChang Winter…
2016.06.24 by 명세환 기자