Siemens Launches Integrated PCB Design-to-Manufacturing Cloud Solution
Siemens has announced 'PCBflow,' a cloud-based software solution for safe and efficient integration throughout the PCB design and manufacturing proces…
2021.04.21 by 이수민 기자
Xilinx Unveils FPGA-Based System-on-Mount (SOM) for Edge Vision Acceleration
Xilinx has launched the Kria portfolio, a production-ready embedded board in a small form factor for vision AI application developers. Kria is an adap…
2021.04.21 by 이수민 기자
u-blox Unveils SARA-R540S Module for LTE Low-Band Bands
u-blox has launched the SARA-R540 module, which supports 400–450MHz LTE frequency bands used in Europe, Asia, and Latin America. The module can commun…
2021.04.21 by 이수민 기자
Infineon Launches 600V MOSFETs Optimized for Static Switching
Infineon's CoolMOS S7 10mΩ is a 600V superjunction MOSFET suitable for applications requiring minimized conduction losses, such as solid-state relays,…
2021.04.20 by 이수민 기자
Maxim and iZip Develop Human Body Recognition Function for Low-Power IoT Devices
Maxim has announced that its neural network MCU, MAX78000, has been applied to the Visual Wake Word (VWW) model of Aichip, an AI company for IoT appli…
2021.04.20 by 이수민 기자
Nokia Deploys ASiR on LGU+'s 5G Network, Strengthening Indoor 5G
Nokia announced that it will deploy its in-building dedicated solution, AirScale Indoor Radio (ASiR) system, on LG U+'s commercial network to improve …
2021.04.19 by 이수민 기자
LG CNS and AhnLab to Develop Cloud-Specific Security Solutions
LG CNS and AhnLab have signed a memorandum of understanding for cloud security business cooperation. Going forward, the two companies will jointly pro…
2021.04.19 by 이수민 기자
Metal 3D printing technology for rapid manufacturing of large parts has been developed.
Metal 3D printers can precisely custom-manufacture any mold with complex shapes, thereby reducing costs from product development to mass production. T…
2021.04.16 by 이수민 기자
5G will be available nationwide by 2024 at the earliest.
The Ministry of Science and ICT and the three telecommunications companies announced a joint 5G service utilization plan for rural areas including eup…
2021.04.16 by 이수민 기자
ROHM Launches 10W Rated Shunt Resistor, "Existing Products Also Enhanced"
Rohm has added the GMR320, which supports a maximum rated power of 10W, to its GMR series of ultra-high power, ultra-low resistance shunt resistors fo…
2021.04.16 by 이수민 기자
Bluetooth devices, '4 billion units shipped in 2020 → 6.4 billion units in 2025'
With the spread of remote work and telemedicine, the completion of LE Audio specifications, and the activation of connected lighting, the Bluetooth pe…
2021.04.15 by 이수민 기자
Microchip Distributes Free Software to 'Accelerate Development' of USB PD Systems
Microchip has launched a Power Delivery Software Framework (PSF) that supports IP modification and ownership of USB-C Power Delivery (PD) systems. Thr…
2021.04.15 by 이수민 기자
Nvidia to Build Arm Core-Based CPUs for Data Centers
NVIDIA is entering the CPU market following GPU and DPU. CEO Jensen Huang unveiled a data center processor with the codename 'Grace' CPU during his ke…
2021.04.14 by 이수민 기자
STMicroelectronics Launches MasterGaN4 Device, Supporting 200W Power Conversion
STMicroelectronics has launched a new MasterGaN4 device that simplifies the design of power conversion applications up to 200W. The new power package …
2021.04.14 by 이수민 기자
Hillshire supports 'MRP' to enhance ring topology network stability.
Hilscher announced that its PROFINET IO devices and equipment controller products now support the PROFINET Media Redundancy Protocol (MRP). MRP enable…
2021.04.14 by 이수민 기자