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명세환 기자

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daniel@e4ds.com

명세환 기자 기자 6,232 articles

TI Launches Wireless Power IC to Revolutionize Mobile Device Charging Methods

2012.11.08 by 명세환 기자

TI launches industry's first ultrasonic analog front end (AFE) with integrated digital demodulator

2012.11.06 by 명세환 기자

Xilinx showcases enhanced trust systems with Zynq-7000 All Programmable SoC at ARM TechCon 2012

2012.11.06 by 명세환 기자

IDT Launches Industry's Lowest Power DDR3-1866 Memory Buffer for High-Performance LRDIMM Applications

2012.11.06 by 명세환 기자

Infineon Launches Single-Chip 24GHz Radar Solution for Industrial and Commercial Sensor Systems

2012.11.06 by 명세환 기자

STMicroelectronics leads the way in delivering Cortex-A57 processors with 64-bit ARM technology for next-generation ASIC solutions

2012.11.06 by 명세환 기자

TI Launches Industry's First LED Driver Integrating Frequency Synchronization, PWM Dimming, and Thermal Foldback Features

2012.11.06 by 명세환 기자

Third-Generation Reverse Conducting IGBT Offers Industry-Leading Efficiency and Reliability

2012.11.06 by 명세환 기자

Soitek-CMP supports next-generation SoC prototypes with 28nm FD-SOI CMOS process

2012.11.06 by 명세환 기자

Selected as a developer of integrated receiver chips based on Qualcomm's wireless power technology

2012.11.06 by 명세환 기자

Flash-based security controller obtains highest level of security certification from the German Federal Office for Information Security (BSI)

2012.11.06 by 명세환 기자

Launch of Battery Monitors for Hybrid/Electric Vehicles

2012.11.06 by 명세환 기자

Infineon's 5th generation thinQ! SiC Schottky barrier diode delivers market-leading efficiency

2012.10.31 by 명세환 기자

TI Improves Performance and Halves Power Consumption with MSP430FR59xx Based on Leading “Wolverine” Technology

2012.10.31 by 명세환 기자

Microsoft Windows Phone 8 Equipped with NFC

2012.10.31 by 명세환 기자