LG Innotek (CEO Moon Hyuk-soo) introduced Ansys' digital twin solution and simulation software to its development process, enabling preliminary design verification through virtual simulation and reducing the development period by 99%.

LG Innotek announced on the 8th that it will expand the application of 'digital twin' technology to all processes in cooperation with Ansys, the world's No. 1 engineering simulation company.

Through this collaboration, LG Innotek will be able to build a global top-level digital twin environment by utilizing Ansys’ latest digital twin solutions and simulation software.

Previously, LG Innotek, together with Ansys, has been achieving visible results by piloting 'digital twins' in some of its development and production processes.

We conduct design verification in a virtual environment and minimize the number and time of actual experiments based on the data.

LG Innotek applied ‘digital twin’ to the development of semiconductor package substrate (PS) products, reducing the development period by 99%.

It is important for the substrate to minimize the 'warpage' phenomenon caused by heat and pressure applied during the manufacturing process.

To this end, a simulation process is conducted to optimize the combination of circuit design structure, material composition ratio, etc.

LG Innotek has shortened the time to predict the degree of 'warpage' of a single substrate from 11 days to 3.6 hours using virtual simulation using 3D modeling.

myIn addition to product development, the application of ‘digital twin’ has been expanded to the FC-BGA (flip chip ball-grade array) production process.

By setting the FC-BGA process equipment to optimal conditions through digital twins, we succeeded in shortening the ramp-up period (expanding production capacity by improving initial yield in mass production) by half.

Previously, it took a lot of time and money to find the optimal FC-BGA process conditions, and hundreds of tests had to be conducted. LG Innotek used 3D modeling to recreate the equipment of the FC-BGA production process in a virtual space.

When a process is carried out in a virtual space, the computer can visualize and identify problems with various process facilities. It can optimize even the most detailed conditions, such as liquid, heat, and air flow, that are difficult to measure in real life inside the facility.

In addition, LG Innotek actively utilized ‘digital twins’ in the production process of electrical components to increase productivity. Electrical components have a long product life and are greatly affected by the weather, so securing quality reliability is very important.

Digital twins were also applied to the soldering process, which is a key process for ensuring reliability of battlefield components. The soldering process was simulated in a virtual space to predict the time it would take for cracks to appear in the solder. The plan is to optimize process conditions, such as solder application amount and nozzle design, to delay crack occurrence as much as possible, thereby increasing productivity by approximately 40% compared to the past.

Through its collaboration with Ansys, LG Innotek plans to rapidly expand digital twins to the development/process of all product lines, including new growth businesses such as vehicle communication modules and LiDAR.

In the future, we plan to expand the application of digital twins to the entire value chain from development to production to include customers and partners.

CTO Noh Seung-won said, “The future that LG Innotek envisions is ‘meta-manufacturing,’ where simulation results through virtual spaces are automatically linked to physical production facilities and lead to actual production.” He added, “To this end, we will quickly apply advanced digital twins to the entire value chain, including R&D, production, and quality control, to create differentiated customer value.”