Favier Shoo, Senior Manager of Strategic Marketing for the Packaging Business Unit at Applied Materials and a global expert in semiconductor packaging, shares his secrets to success in semiconductor packaging.

Fabier Shu, Senior Manager at Applied, will present on the topic of ‘ Enabling Heterogenous Integration with Advanced Packaging Technology ’ at the ‘ 2023 e4ds Semiconductor Packaging Day ’ to be held on June 28.

Fabie Shu is a highly accomplished Senior Manager in Strategic Marketing for Applied Materials’ Packaging business unit, with over 10 years of experience in semiconductor packaging.

He has a keen eye for industry trends and potential for change, and is highly capable of writing compelling technical business plans and delivering comprehensive market analysis presentations. />
Senior Manager Fabier Shu continuously sets strategic goals that drive success in line with business objectives.

Prior to joining Applied Materials, he spent three years at Yole Development, where he led the packaging business unit, developed technical and market reports, conducted quarterly monitoring and strategic consulting studies.

Prior to that, he worked as a Customer Application Technologist at Applied Materials for seven years, explaining product differentiation to win new business.

Fabier Shu, Senior Manager, holds a Bachelor of Science degree with honours in Materials Science and Engineering from Nanyang Technological University (NTU), Singapore.

His academic pursuits were further strengthened when he chose a minor in Entrepreneurship, which aligned with his passion for innovation and business development.

As a co-founder of a startup, Fabière Shu, Senior Manager, also developed the company's business goals, revenue model, and marketing plan.

“As a speaker at this conference, Fabier Shue will bring a wealth of insight based on his extensive experience in strategic marketing, in-depth knowledge of semiconductor packaging, and track record of driving business growth,” said Senior Manager Schuh. “Conference attendees will not only gain valuable insights into the industry, but also learn practical strategies for success in the rapidly evolving semiconductor packaging space.”

Meanwhile, e4ds will hold the ' 2023 e4ds Semiconductor Packaging Day ' event at the Korea Conference Center Main Hall on June 28. At this seminar, top domestic and international packaging experts, including Intel, Nepes, Applied Materials, Hanyang University, and Hyundai Motor Securities, will present next-generation packaging solutions. Participation in the event can be done on the ' 2023 e4ds Semiconductor Packaging Day ' ( https://www.e4ds.com/seminar_introduce.asp?idx=137 ) website.